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  • MICRO: Thermal Processing
    material must be optimized. An excessively rapid thermal treatment can cause the polymerization of the surface and prevent adequate moisture or solvent evaporation from the bulk of the SOD. Outgassing can cause trapping of hot and volatile compounds under the fully polymerized SOD surface layer
  • Characterizing a rapid thermal annealing process to improve sensor yield
    in the production of acceleration sensors, surface micromachining requires the integration of traditional semiconductor processing with a sound, thorough understanding of material properties and mechanics. Basically, these silicon-based precision sensors convert a raw physical input signal
  • MICRO: World Beat
    The "newest entrant into the Chinese foundry market" has purchased several rapid thermal process (RTP) tools and strippers from Mattson Technology, an executive of the company says. The Fremont, CA based supplier has received orders for RTP and Aspen strip systems from the foundry. The factory
  • MICRO: Industry News: Expansions and Acquisitions (April 2000)
    customer base piqued Steag's interest. CuTek was founded in 1997. The company's board of directors has approved the merger. Headquartered in Essen, Germany, Steag Electronic Systems says it has an installed base of more than 1500 rapid thermal process tools around the world. The
  • The Effect Of Cold Work On The Thermal Stability Of Residual Compression In Surface Enhanced In718 (.pdf)
    of. surface enhancement are lost if the compressive. layer relaxes at the operating temperature of the. component. Surface enhancement methods. producing minimal cold work are shown to produce. the most thermally stable compression. The residual stress and cold work distributions. developed in IN718
  • Heat Sink Success Story
    Our client's product release was dependent upon a manufacturer that could deliver high volume thermal devices meeting highly technical specifications. The nature of the product experienced rapid changes due to the quantum of technology evolution. We developed a robust scalable manufacturing system
  • MICRO: TechEmergent
    implantation processes to achieve ultrashallow ( <500- A) implantation depths. Several types of annealing methods, including rapid thermal-spike anneals, laser annealing, and flash-lamp annealing, are known to minimize the diffusion of dopants, thus forming low-resistivity ultrashallow junctions (USJs
  • MICRO: Industry News: 'Round the Circuit (September 2000)
    009;A calibration wafer developed by NIST improves chipmakers' ability to accurately measure and control temperature during rapid thermal processing (RTP). The test wafer is designed to meet the semiconductor industry's need to reduce temperature measurement uncertainty to 2 C. Thin-film

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