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  • Characterizing organic impurities in semiconductor-grade hydrogen peroxide
    As the semiconductor industry moves toward the 256-Mb chip generation with 0.15- um feature sizes on 300-mm wafers, wet chemical cleaning remains essential to the removal of particles and metallic and organic impurities from the wafer surface. Since semiconductor-grade hydrogen peroxide
  • MICRO: Ultrapure Fluids - Winters (April 2000)
    L eon Winters, Philips Semiconductors; and Joseph Zahka, Millipore During the manufacture of semiconductor devices, the wafer surface is exposed at numerous process steps to potential sources of contamination, including particles, inorganic ions, and organic residues. To ensure a stable production
  • MICRO: News lead
    Opportunities abound, but funding is tight for start-ups THE BIG PICTURE: Veteran venture capitalists say semiconductor tool and other supplier start-ups have to work hard to secure financing. For potential semiconductor equipment, materials, and software start-ups, linewidths aren't the only
  • MICRO: Wet Surface Technology
    Izzy K. Bansal, M/A-Com, a Tyco Electronics company Experiments involving various surface-cleaning methods demonstrate that an ultradilute approach can reduce chemical consumption, lower costs, and help protect the environment. he semiconductor industry has been highly successful in rapidly
  • MICRO: Green Manufacturing
    surveys ozone applications in the semiconductor manufacturing industry and provides sample data from users and researchers. Ozone Uses in the IC Industry For more than 20 years, semiconductor industry researchers have investigated the use of ozone for wafer-cleaning and resist-stripping applications
  • Evaluating reusable HDPE containers for delivery of high-purity hydrofluoric acid
    R. Thomas Talasek, Brian K. Hunt, and David C. Cooke, As semiconductor device geometries continue to shrink, the purity of process chemicals has become even more critical. Nowhere is this more evident than in the specifications for reducing metallic and particulate impurities, especially
  • MICRO: Vereecke
    steps. As devices continue to shrink, new cleaning technologies must be developed to remove particles smaller than 50 nm. Many people involved in semiconductor manufacturing doubt that megasonic cleaning will remain the success story it has been until now. Its physical action might not be sufficient

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