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  • Evaluating chemical mechanical cleaning technology for post-CMP applications
    to as DSS. While the scrubbing process is well documented, advances in CMP technology and tighter defect specifications place an ever-increasing burden on the cleaning step. The capabilities of any post-CMP clean must evolve to stay effective. An example of this evolution is the addition of more
  • Using Organoclays for Efficient Dewatering (.pdf)
    Organoclays have been used as a pre-polisher for activated carbon or as a post-polisher for oil/water separators and dissolved air flotation units for the removal of small amounts of oil, grease, PCB, PNA, BTX and other organic hydrocarbons of low solubility for cleanup of groundwater
  • MICRO:Process Equipment-CMP Consumables, by Douglas W. Cooper, p.53 (July '99)
    Douglas W. Cooper and Rob C. Linke, Whether used to remove excess metal or oxide from IC chips or thin-film data-storage disks, chemical-mechanical polishing or planarization (CMP) has become an increasingly important and rapidly growing technology. Most CMP combines chemical activity with abrasion
  • MBF Filters Excel in Ethanol Plant (.pdf)
    An ethanol production plant required RO treated water for their boilers, cooling towers, and fermentation process. In all cases the incoming water was first treated by an RO membrane. Additional post RO treatment was then used to meet the water quality requirements of the end use of the water
  • Where Do We Start? What Is Done With the Data?
    . Also, it is a good idea to remove batteries from the camera when it is not in use. Once the thermal images are captured, level, distance, emissivity, and span can be changed in post image processing.
  • MICRO:
    with the environmental regulations dictating that wastewater contaminated with heavy metals be treated prior to discharge. Copper concentrations in CMP and post-CMP cleaning effluents range from 1 to 25 mg/L and must be removed from the waste stream. To date, most of the removal options involve
  • MICRO: Wet Surface Technologies
    investigates cleaning processes that use three different mechanisms to remove contamination from copper surfaces and discusses their compatibility with specific barrier slurry systems. It also probes the impact of alkaline post-CMP cleaning formulations on cleaning efficacy. In addition to studying
  • MICRO: Surface Conditioning - Hakanson (March 2000)
    Andy Hakanson and Narendra Garg, ; and Michael R. Borden and Harlan F. Chung, Cleaning processes for removing chemical-mechanical polishing (CMP) residues rely on double-sided brush scrubbers and the use of harsh chemistries (typically ammonium hydroxide and hydrogen peroxide). Unfortunately

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