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  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    this technology in its etchers, wafer track, and other systems by the middle of 2002. Hynix moves closer to wafer-level test of fast DRAMs SEOUL -- Korea's Hynix Semiconductor Inc. has demonstrated the ability to perform high-speed wafer-level testing of DRAM devices using a probe system from Teradyne Inc
  • M542: Electrical Characterizations of Packages for use with GaAs MMIC Amplifiers
    A test methodology will be presented which combines the advantage of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel "test fixture" capable of electrically characterizing most any style package or device. This scheme has been used to characterize many
  • Metrigraphics Article in Today's Medical Developments
    gelatin capsule - the same size capsule you might take as your daily vitamin. "Then there are purely structural parts we produce, such as a spring used for testing probes in the semiconductor industry," Sablich says. "The spring is quite large compared to some of the springs and devices we make

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