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  • RF Test Gage R&R Improvement
    of variation in RF probe measurements. Tester Gage study results are presented. Evaluations of factors including test instrument repeatability, probe card wear, probe tip planarity, probe pressure, and probe placement within the bond pad are presented. The data indicated the repeatability of the test
  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    to the wafer fab process engineer. Adding wafer level RF tests provides quicker feedback. and reduces the time required to complete a cycle of. learning. This paper discusses the RF wafer probe tests. used to evaluate the continuous improvements in. Skyworks' pHEMT wafer process.
  • | Electronics Industry News for EEs & Engineering Managers
    this technology in its etchers, wafer track, and other systems by the middle of 2002. Hynix moves closer to wafer-level test of fast DRAMs SEOUL -- Korea's Hynix Semiconductor Inc. has demonstrated the ability to perform high-speed wafer-level testing of DRAM devices using a probe system from Teradyne Inc

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