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  • Description: In response to industry demand and our customer's needs, Rayotek has created a separate grinding facility dedicated to massive grinding operations. Our 5-Axis Grinding System was built after a 3-year engineering project to design the ultimate system for precision grinding and polishing large

    • CNC Machining: Yes
    • Capabilities: Drilling, Milling, Turning, Centerless Grinding, ID / Internal Grinding, OD / External Grinding, Surface Grinding, Etching / Chemical Milling, Laser Machining, Other
    • Location: North America, United States Only, Southwest US Only, Europe Only, East Asia / Pacific Only
    • Materials: Ceramics, Glass, Glass Ceramics, Quartz, Sapphire / Ruby, Other

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  • Description: Our full-service capabilities provide our customers with a single-source facility for designing, engineering and manufacturing sapphire, glass, fused silica and fused quartz products. As a single source supplier we can take a customer's concept from design, through engineering and to the

    • Additional Operations: Chemical Treating, Glass to Metal Bonding, Glass to Ceramic Bonding, Etching / Blasting, Heat Treating, Hermetic Sealing, Lapping / Polishing, Other
    • Application Expertise: Architectural, Chemical Process, Lighting, Optical / Semiconductor, Other
    • Fabrication Services: Design Assistance, Glass Blowing / Assembly, Glass Part Fabrication, Glass Cutting / Profiling, Glass Repair, Materials Development / R&D, Material Selection, Inspection / Testing, Specialty / Other
    • Location: North America, United States Only, Southwest US Only, Europe Only, East Asia / Pacific Only

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  • Description: No Description Provided

    • Application: Aerospace / Defense, Biotechnology / Medical, Automotive, Computer / PC, Fiber Optics / Telecommunications, Imaging / Vision, Wireless
    • Device Type: Analog, ASIC , High Voltage, Logic, Memory, Passive Components, Sensors, Specialty / Other
    • Device Voltage: 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3 V, 3.3 V, 5 V
    • Location: North America, United States Only, Southwest US Only

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  • Description: dry semiconductor processes including: Etching Stripping Cleaning PVD LPCVD, HDPCVD, PECVD, SACVD, ALD Dynamic seals Bonded Gate Valves & Isolation Valves Pendulum Valves Slit Valves

    • Synthetic Rubber Materials (Thermosets): Perfluoroelastomer (FFKM, FFPM)

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  • Description: wet and dry semiconductor processes including: Plasma Etching Ash/Resist Stripping LPCVD, HDPCVD, PECVD, SACVD, ALD Cleaning PVD Dynamic seals Bonded Gate Valves & Isolation Valves Pendulum Valves Static seals

    • Hardness Rating (Shore A Scale): 65 durometer
    • Synthetic Rubber Materials (Thermosets): Perfluoroelastomer (FFKM, FFPM)

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