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  • [Chapter 6] 6.2 A Case for Study<
    Lenny, on our staff, was having difficulty converting a document coded for Scribe to our macro package, because of font changes. The problems he encountered are quite interesting, apart from the task he was trying to do. The Scribe convention for putting text in a bold font is: This font change
  • Semiconductor Micromachining Using Diode-Pumped Solid-State Lasers
    ) industries for aplications including wafer dicing, scribing, direct via forming, and three-dimensional structuring. In the current study, two Qswitched and one mode-locked diode-pumped solid-state (DPSS) 355 nm lasers have been used to scribe grooves on silicon and sapphire wafer substrates
  • Compact slide helps "board breaker " squeeze into cramped quarters
    . The singulator, developed by TSG Automation, Ivyland, Pa., automates the process of breaking ceramic snapstrate panels into individual parts used to produce hybrid components. The machine features dual breaker units that both clamp and strip to insure a clean break on the scribe line. At the first
  • MICRO: STI Process Control
    , such as a large pad or scribe line. In order to point the beam at the nonpatterned area, a vision system and pattern-recognition algorithms are used in conjunction with an accurate mechanical stage to move the wafer to the target measurement coordinates. However, the need to isolate the measurement site
  • MICRO:Product Technology News (May '99)
    A laser cutting tool for flat-panel display glass makes high-quality cuts without creating particles. While glass has traditionally been cut using a mechanical scribe-and-break process that causes fragmentation, edge chips, and microcracks that may generate particles, the laser technique uses

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