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  • Effect of Silver in Common Lead-free Alloys
    Silver bearing alloys have been used in electronics soldering for many years. Silver has been used in tin-lead solders (Sn62Pb36Ag2) to combat silver scavenging from silver plated electronic components as well as to improve thermal fatigue resistance. Many of the common lead-free alloys contain
  • iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry
    cost of alloys containing significant amounts of silver. Concerns regarding the poor drop/shock performance of near-eutectic SAC alloys led to the development of low Ag alloys to improve the mechanical strength of BGA and CSP solder joints. Most recently, investigations into new solder paste alloys
  • Conductor Materials
    range of conductive materials including bare, tinned, nickel and silver plated copper, alloy, pure nickel or silver, various stainless steels, Monel (R) and bronze as well as textiles (nylon, cotton, fiberglass, Aramid, Polyester) and monofilament.
  • The Proliferation of Lead-Free Alloys
    eutectic tin-silver-copper alloy SAC387 (Sn95.5Ag3.8Cu0.7) as an initial favorite to fill this need in the early 2000s. Read more:
  • When Appearance is Critical, Think Brazing
    alloy. To form the sunglass front, they are joined together by induction brazing in a series of steps. At each step of the process, they are. held in place by a jig. The Handy & Harman/Lucas-Milhaupt brazing filler metals typically used for the joints are 50% silver-bearing alloys such as Braze 505
  • Unique Qualities of Stainless Steel PH15-7MO
    to compare this PH alloy surface to the other grades of stainless steel. 300 and 400 series stainless steel exhibit a bright, shiny, silver color surface. These alloys contain only constituent elements whose oxides are easily reduced using mechanical or chemical means.
  • Effect of Multiple Reflow Cycles on Solder Joint Formation and Reliability
    was investigated. In the first part of the study, small size BGA's were assembled with 12mil spheres of a number of low silver lead-free solder alloys. Substrate surface finish used was Cu-OSP. Components were subjected to up to six Pb free reflow cycles. After reflows, joints were cross-sectioned
  • Copper
    shapes, forgings, wire, and castings. These metals are grouped according to composition into several general categories: coppers, high-copper alloys, brasses, leaded brasses, bronzes, aluminum bronzes, silicon bronzes, copper nickels, and nickel silvers. Copper-based alloys form adherent films

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