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  • Lambda Technologies’ Variable Frequency Microwave Adopted by Polymer Flip Chip
    Following a six-month joint evaluation project, Polymer Flip Chip has purchased a Lambda Technologies MicroCure 5100-2000 VFM system to cure both the polymer bumps and underfill encapsulants on their flip chip-based RFID and Smart Card products.
  • lambda technologies variable frequency microwave adopted by polymer flip chip
    Following a six-month joint evaluation project, Polymer Flip Chip has purchased a Lambda Technologies MicroCure 5100-2000 VFM system to cure both the polymer bumps and underfill encapsulants on their flip chip-based RFID and Smart Card products.
  • Area Array Packaging Handbook: Manufacturing and Assembly > POLYMER PACKAGING MATERIALS: ADHESIVES, ENCAPSULANTS, AND UNDERFILLS
    Today’s increased activity and the introduction of new materials are the result of strong growth in BGAs, micro-BGAs, MCPs, smart cards , and other bare-die products. The most popular encapsulants are molding compounds, but liquids, such as “glob tops” and the newer casting …
  • Subject index
    Hyoung-Joon Kim, + , T-CPT Jun 03 367-374 Ion transport in encapsulants used in microcircuit packaging. Lantz, L., II, + , T-CPT Mar 03 199-205 Digital systems; cf. Smart cards DNA BioMEMS, thermal mgt..
  • Underfill encapsulant technology for flip chip assembly
    This is a feature already demanded for some overjll encapsulant applications iusing "thin" substrates such as SMART CARDS . Lower Cost Encapsulants : .
  • Approaches to electronic miniaturization
    The smart card is a unique blend of design, materials, and manufacturing technology. The disparate materials systems-thin polyesterPWB’s, siliconIC’s, plastic structuralmember,inked PVC labels, epoxy encapsulants , and thermosetting adhe …
  • UV cationic systems for smart card/tag applications
    The use of UV adhesives in the production of Smart Card /Tag modules has offered users processing speeds unmatched by heat cure Photopolymerisation of die encapsulants by cationic initiationhas generatedreal commercialinterest.
  • Modelling of ICA creep properties
    Thus, the benefits of flip chip technology can be realised in low cost applications such as smart cards and disposable lab-on-chip applications (LeClair et al. 1998). The change in the viscoelastic material properties of epoxy-based adhesives and encapsulants is most pronounced at …
  • Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper
    Similar circuits on paper are particularly interesting, not only for applications in smart cards and related but also for their capacity to add functionality to paper-based microfluidic diagnostic devices.[28] Figure 4D and the left frame of Figure 4E show CMOS … Encapsulants with low moduli provide the most freedom of motion and, therefore, the highest levels of stretchability.
  • ZCP2002ISTFA235
    J. E. Semmens and S. Canumalla, "Application of highly focused, high frequency transducers for evaluation of near-surface flaws and thin packages: Smart cards , Flip chip, Flex circuits and Thick films, Interpack 99. S. Canumalla and M. G. Oravecz, "Nondestructive Elastic Property Characterization of IC Encapsulants ," ASME Symposium on …