Products & Services

See also: Categories | Featured Products | Technical Articles | More Information

Conduct Research Top

  • M538: Surface Mounting Instructions - Footprint Guidelines
    over bare copper (SMOBC) should be utilized to contain solder and eliminate alignment problems during solder reflow. Electrical and/or thermal considerations may also require the board to contain plated vias located under the surface mount package. When this is necessary, the recommended via diameter
  • No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
    in the field. One method of reinforcement has been the utilization. of underfills to "glue" certain surface mount devices (SMDs) to the PCB. This provides additional mechanical strength over and above the soldered. connections. Bumped SMDs attached to the PCB with a no-clean soldering. process
  • AN0012 Electronic Lighting Ballasts
    for a starter, thus saving energy and costs. With more manufacturers of high frequency electronic ballasts converting to low cost surface mount capacitors, for use in the snubber circuit of the ballast, Syfer Technology Ltd has introduced a range of capacitors specifically intended for this application

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire