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  • Understanding Low Outgassing Adhesives
    Understanding Low Outgassing Adhesives. Applications that need to meet stringent outgassing requirements now have more adhesive options than ever. One of the most common issues addressed by our technical. service department nowadays involves the outgassing. characteristics of adhesives and related
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Applied, Novellus, JSR tip future low-k plans SAN FRANCISCO -- Hoping to get an early jump in the 90- and 65-nm technology nodes, chip-equipment and material vendors are quietly showing their next-generation, low-k dielectric offerings to enable new, high-speed ICs. According to sources
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    NEC tips 55-nm process with high-k, immersion NEC Electronics Inc. has rolled out what the company claims is the industry's first 55-nm standard CMOS process technology for use in next-generation, system-on-a-chip (SoC) designs with ultra-low power consumption. Options probe delays Semtech's
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    a consensus on royalty payments and other issues. Moreover, the absence of one key patent holder Qualcomm Inc. in formal negotiations may cause new difficulties. Update: Moto combines copper, low-k dieletric Leapfrogging ahead in a critical race, researchers at Motorola Inc. have succeeded
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Heard on the Beat (March 22) Heard on the Beat (March 22) Commentary & analysis of week's chip news, March 18-22 Low-k war rages despite slow progress; Applied plans 'Black Diamond II' SANTA CLARA, Calif. -- Low-k dielectric technology is probably one of the hottest-contested growth potentials
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    semiconductor industry in April, according to the Semiconductor Industry Association (SIA) Friday (May 30). Intel, Sony, TSMC, Toshiba to show low-k roadmaps Frustrated with the integration issues of low-k dielectric materials, chip makers next week will present several novel approaches
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    package ATMI claims first complete low-k materials management solution Fujitsu charts new course in flash after DRAM debacle Taiwan's SiS rolls out single-chip graphics, logic for AMD's Athlon Vitesse completes purchase of SiTera for $750 million in stock Malaysia's Silterra will get $674 million loan
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    ' CTO on low-k issues No production stops reported in Japan quake Camera phones outsold digital still cameras H1, says report Sematech, Schott to cooperate on EUV mask blanks Fab lists; top IC makers since '65 Intel steps up the DDR2 push Philips opens fab for liquid crystal on silicon panels

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