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Supplier: Richardson RFPD
Description: The NimbeLink NL-SW-LTE-QBG95 embedded modem provides LTE-M (CAT M1) and NB-IoT (NB1, NB2) connectivity for global applications with fallback to 2G at lower power than the BG96 processor. It utilizes the Qualcomm 9205 chipset and Quectel BG95-M3 module. This embedded modem also
- Modem Type: Cellular Modem
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Supplier: QUALCOMM, Incorporated
Description: The MDM9207-1 LTE modem offers device makers, system integrators, and developers a commercially proven chipset platform with high quality 3G/4G LTE multimode and multiband support, designed to bring reliable cellular connectivity on major network carriers worldwide. With Category 1
- Data Rate: 5000 to 10000 kbps
- Device Type: Modem
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Supplier: Intelligraphics, Inc.
Description: IGX-UACAH1-9377a1-BT is an 802.11ac/abgn 2.4GHz+5GHz USB module based on Qualcomm QCA9377-7 chipset. It supports 1T1R with RX diversity (Support Wi-Fi) technology, which runs up to 433Mbps, provides higher throughput performance, reliability and range. The IGX-UACAH1-9377a1-BT
- Area Network Type: Wireless Local Area Network (WLAN)
- Data Rate: 0.4330 Gbps
- Frequency Band: 2472 MHz
- Modem Type: Radio Modem
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Supplier: Intelligraphics, Inc.
Description: IGX-UACC1-9377a1-BT is an 802.11ac/abgn 2.4GHz+5GHz USB module based on Qualcomm QCA9377-7 chipset. It supports 1T1R with RX diversity (Support Wi-Fi/BT co-existence) technology, which runs up to 433Mbps and 1~3Mbps EDR for BT, provides higher throughput performance, reliability and range.
- Area Network Type: Wireless Local Area Network (WLAN)
- Data Rate: 0.4330 Gbps
- Frequency Band: 5825 MHz
- Modem Type: Radio Modem
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Supplier: Intelligraphics, Inc.
Description: IGX-PACAF1-9880a1 is a IEEE 802.11ac wireless adapter that operates in 2.4GHz and 5 GHz bands, available in PCIe mini card form factor. Featuring QCA9880 chipset, the IGX-PACAF1-9880a1 dramatically increases the overall throughput up to 1.3Gbps with 3 x 3 MIMO techniques. Leveraging
- Area Network Type: Wireless Local Area Network (WLAN)
- Data Rate: 1.3 Gbps
- Frequency Band: 5850 MHz
- Modem Type: Radio Modem
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Supplier: Intelligraphics, Inc.
Description: IGX-PACD1-6174a1-BT is an 802.11ac/a/b/g/n Dual -Band WiFi + bluetooth M.2 card based on Qualcomm Atheros QCA6174A chipset. It was opened to test functionality. It is dual band AC on 2.4 and 5GHz and incorporates the latest Bluetooth 4.2. The slot type is M.2 2230. The download speed is
- Area Network Type: Wireless Local Area Network (WLAN)
- Data Rate: 0.8670 Gbps
- Frequency Band: 5850 MHz
- Modem Type: Radio Modem
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Supplier: Radicom Research, Inc.
Description: Radicom Research's RW8200 Embedded WiFi Module supports Serial, SPI and optional USB interfaces. It integrates an ARM Cortex-M3 host processor, Broadcom's Wireless Internet Connectivity for Embedded Devices (WICED) supported WiFi chipset, RF front end, clocks and on- board antennas or
- Form Factor: Board
- Modem Type: Radio Modem
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Supplier: Radicom Research, Inc.
Description: Radicom Research’s RB730 and 730SD (Shielded) are Bluetooth modules featuring Human Interface Device (HID) support. Based on Broadcom BCM20730 Bluetooth chipset, the modules integrate with PCB antennas, serial EEPROMs, crystals and components for built-in switching regulators to reduce
- Form Factor: Board
- Modem Type: Radio Modem
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Supplier: QUALCOMM, Incorporated
Description: step on the path to 5G—helping more operators around the world bring fiber optic speeds wirelessly to your device for the latest generation of mobile experiences. Cellular Modem Chipset Snapdragon X20 LTE Modem LTE Category LTE Category 18
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Supplier: Radicom Research, Inc.
Description: Radicom Research’s RB4000 and RB4000HM Bluetooth modules are designed to meet OEM’s needs of embedding short-range wireless data connectivity to their products. The RB4000 family offers a quick and simple solution for wireless point-to-point communications. The RB4000 series
- Form Factor: Board
- Modem Type: Radio Modem
- Operating Mode: Point-to-Point
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Supplier: Radicom Research, Inc.
Description: Radicom Research’s RB4000 and RB4000HM Bluetooth modules are designed to meet OEM’s needs of embedding short-range wireless data connectivity to their products. The RB4000 family offers a quick and simple solution for wireless point-to-point communications. The RB4000 series
- Form Factor: Board
- Modem Type: Radio Modem
- Operating Mode: Point-to-Point
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Supplier: Acme Chip Technology Co., Limited
Description: RF TXRX MODULE CHIPSET
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Supplier: Telit IoT Solutions, Inc.
Description: The GE864-QUAD V2 is the chipset-generation evolution of the best seller GE864-QUAD quad-band module. You can take advantage of the enhanced features and power profile of the V2 with an easy migration from previous module versions, upgrading your devices with short time-to-market. Since
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Supplier: Telit IoT Solutions, Inc.
Description: The GL865-QUAD V3 is a quad band GSM|GPRS module based on the latest release of Intel's 2G cellular chipset, protecting our customers' design investments with longterm availability. This variant features VQFN packaging in lieu of LCC castellation of the original GL865 but maintains full pad
- Data Rate: 9.6 kbps
- Device Type: Modem
- IC Package Type: Other
- Interface: Other
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Supplier: Telit IoT Solutions, Inc.
Description: The V3 variant of the GL865-DUAL is based on the latest chipset technology, designed to protect your investments as a low-cost, long-term availability solution. It is recommended for any new cost-sensitive designs requiring 2G GSM/GPRS coverage and long term application cost stability, such
- Device Type: Modem
- IC Package Type: Other
- Interface: Other
- Sensitivity: -108 dBm
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Supplier: Telit IoT Solutions, Inc.
Description: The UL865 is a 3G module in the xL865 family. It is based on the latest Intel chipset to protect the developer's design investments as a long term availability solution. The UL865 features VQFN packaging that is fully pad-level compatible with its 2G companion, the GL865-DUAL V3. Key
- Data Rate: 9.6 kbps
- Device Type: Modem
- Features: RoHS Compliant
- IC Package Type: Other
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Supplier: Intel Corporation
Description: C) solutions help you get new mobile products to market fast with 64-bit multi-core Intel® Atom™ CPUs. The integrated, multi-mode LTE and 3G Intel® modems deliver world-class performance and global coverage. The full chipset includes the image sensor processor
- Clock Speed: 1600 MHz
- Data Bus: 64-Bit
- Power Dissipation: 8100 milliwatts
- RAM: 8.00E6 KB
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Supplier: Intel Corporation
Description: C) solutions help you get new mobile products to market fast with 64-bit multi-core Intel® Atom™ CPUs. The integrated, multi-mode LTE and 3G Intel® modems deliver world-class performance and global coverage. The full chipset includes the image sensor processor
- Clock Speed: 1800 MHz
- Data Bus: 32-Bit
- RAM: 2.00E6 KB
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Supplier: Intel Corporation
Description: C) solutions help you get new mobile products to market fast with 64-bit multi-core Intel® Atom™ CPUs. The integrated, multi-mode LTE and 3G Intel® modems deliver world-class performance and global coverage. The full chipset includes the image sensor processor
- Clock Speed: 2000 MHz
- Data Bus: 32-Bit
- RAM: 2.00E6 KB
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Supplier: Intel Corporation
Description: C) solutions help you get new mobile products to market fast with 64-bit multi-core Intel® Atom™ CPUs. The integrated, multi-mode LTE and 3G Intel® modems deliver world-class performance and global coverage. The full chipset includes the image sensor processor
- Clock Speed: 2133 MHz
- Data Bus: 64-Bit
- RAM: 4.00E6 KB
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Supplier: OnLogic Inc.
Description: embedded H110 chipset. Supporting up to 32 GB of RAM and advanced features, including dual independent display and true 4K resolution, this system perfectly complements the most demanding multimedia applications. The MC600-52 is also available with optional 4G LTE connectivity, enabling
- Features: Integrated BluetoothTM Technology
- Processor: Intel®, Other
- RAM: 32 GB
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Supplier: OnLogic Inc.
Description: ) push the limit of what's possible with embedded computing. The C246 chipset enables Xeon processing and ECC memory for rugged server capability at the edge and allows for real-time machine learning, object detection, and behavior recognition while minimizing the dependency on large-scale
- Features: Integrated BluetoothTM Technology
- Operating System: Microsoft®
- Processor: Intel®, Other
- RAM: 64 GB
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Supplier: OnLogic Inc.
Description: configured with an integrated cellular modem, pre-certified to operate on many of the world’s most popular cellular carrier networks using a SIM card. Our 4G capable hardware is ideal for today's mobile, edge computing, and Industrial Internet of Things (IIoT) applications. The
- Features: Integrated BluetoothTM Technology
- Operating System: Microsoft®
- Processor: Intel®, Other
- RAM: 64 GB
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Supplier: Handheld
Description: Bluetooth for short-range wireless connection to other equipment, or 802.11 WLAN if you have a local network you'd like to sync with. The fully integrated 3G antenna and modem provide high-speed GSM/UMTS/EVDO data transmission. Anytime-anywhere Internet access is the key to
- Display Size: 7 inch
- Features: Touch Screen, Handheld / Portable, Integrated BluetoothTM Technology
- Operating System: Microsoft®
- Operating Temperature: -27.4 to 145 F
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
applied an innovative optoelectronic technology to overcome one of the biggest problems facing computer systems today -- memory latency. Qualcomm integrates WLAN functions into handsets Wireless technology provider Qualcomm Inc. has announced that its Mobile Station Modem chipsets will support Philips
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Internet of Things, Smart Spaces, and Next Generation Networking
Wireless Modem Chipsets , Renesas Mobile Corporation, .
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Elan Digital releases USB-to-SDIO Host Bridge Chip
A growing number of wireless modem chipsets are moving to SDIO as the preferred data interface and the VUB300 is the ideal solution when, for example the target system has no spare SDIO ports available.
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ParthusCeva SmartCores are Foundation of Wireless Modems from Korea's EoNex
ParthusCeva DSP cores will be powering these EoNex wireless modems chipsets .
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Agilent Technologies Announces Wireless Communications Test Set With Innovative Enhancements That Accelerate Manufacturing Test
One key element is the advanced sequence analyzer, which works in synchronization with the test modes in wireless - modem chipsets to eliminate signaling overhead and enable multiple measurements from a single acquisition.
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Altera and Sequans Provide First Mobile WiMAX Base Station Modem Chipset
Comprised of three Stratix® II FPGAs,the Sequans SQN2110 modem chipset provides wireless OEMs with a ready-made solution for developing mobile WiMAX systems.
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Xronet chooses Analog Front-end from Cosmic Circuits for their WiFi Chip-set solutions
Xronet Corp., a fables semiconductor company with its head office in South Korea, develops and provides wireless chipsets including baseband modem SoCs, RF transceiver ICs, Power Amplifiers, and also complete turn key solutions with protocol software stack and application software.
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A 13-b Linear, 40-MS/s Pipelined ADC With Self-Configured Capacitor Matching
From 2000 to 2002, he worked at Texas In- struments Inc., Bangalore, India, as an IC Design Engineer designing mixed-signal circuits for cable modem and wireless LAN chipsets .
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Development of an Enhanced Emergency Locator Transmitter for General Aviation
The idea behind the system described in this paper is to take advantage of emerging new silicon accelerometers, embedded GPS chipsets , and inexpensive wireless modems to develop an Enhanced Electronic Location Transmitter (E2LT) which dramatically improves upon the performance of existing ELT…
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An effective cache-index forwarding over wireless network for the World-Wide Web
This paper is the result of “Development of Wireless Data Communication Modem Module and Chipset ” that has performed by “Korea Electronics Technology Institute” and has sponsored by “Ministry of Information and Communication” .
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Virtual socket interfaces for wireless network
1This paper is the result of ”Development of Wireless Data Communi- cation Modem Module and Chipset ” that has performed by ”Korea Elec- tronics Technology Institute” and has sponsored by ”Ministry of Informa- tion and Communication”.