Semiconductor Wet Process Equipment Information
Semiconductor wet process equipment is used for the following in semiconductor and microelectronics manufacturing:
- chemical mechanical polishing (CMP)
- spin coating
Suppliers of semiconductor wet processing equipment provide mechanical spinning and polishing equipment, as well as the rinse tanks, baths, hoods, and chemical delivery systems needed for semiconductor wafer processing and fabrication. Selecting semiconductor wet process equipment requires an analysis of supplier costs and capabilities, as well as an understanding of the semiconductor manufacturing process.
Semiconductor wet process equipment is used to form silicon ingots that are sliced into thin wafers. To create additional layers, semiconductor manufacturers use spin coating, a process that applies a substrate to a surface. When the surface is spun, the substrate is distributed via centrifugal force. Epitaxy, the next step in the semiconductor fabrication process, removes variations in the metallization layers of the wafer. Photolithography records an image on a photoresist that is oxidized through high-temperature exposure. Semiconductor wet process equipment is also used for etching and washing. Wet processing strips the oxide from those areas of the wafer that lack a lithographic pattern, leaving the oxide barriers to prevent contamination of the underlying silicon during later processes. When semiconductor etching is complete, wet strippers are used to remove the photoresist, an organic material that can cause defects on the wafer surface.
After the aluminum and dielectric isolation oxide layers are applied, semiconductor wet process equipment is used for chemical mechanical polishing (CMP). CMP is designed to polish the semiconductor wafer after diffusion, implantation, deposition, oxidation, and metallization processes. This stage in the semiconductor manufacturing process is also known as planarization. With semiconductor wet process equipment, planarization polishes the wafer surface smooth by orbital actions intermediated with a chemical slurry. After polishing, additional layering, impact testing, assembly, and packaging occurs and all phases of semiconductor wet processing are complete.
Electronics360—Chip-Making Process Packs More onto Wafer Space
Engineering360—Etching Process Bonds Metals to Almost Any Surface
IEEE Spectrum—Beyond Silicon's Elemental Logic
Guillaume Paumier / CC BY-SA 3.0