Sensors Converge 2026: UpbeatTech highlights vibration sensing across use cases
 
View web version 27 May 2026 — Issue 5 | Vol 22
 
Industrial Imaging - GlobalSpec
 

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Sensors Converge 2026: UpbeatTech highlights vibration sensing across use cases

Sensors Converge 2026: UpbeatTech highlights vibration sensing across use cases

CEO Jerry Chen demonstrated MEMS-based vibration sensing applications spanning drones, headsets, recording devices and industrial monitoring. Read more →

High-speed GigE Vision, anywhere, without bottlenecks

Pleora Technologies Inc.

High-speed GigE Vision, anywhere, without bottlenecks

Extend GigE Vision performance to compact platforms with GEV-TB. High-speed, low-latency image transfer over Thunderbolt, reduced CPU load and flexible integration — unlocking powerful, cost-efficient imaging on laptops and embedded systems.
 

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Measurement of thermal stress-induced deformation of electronic circuit boards

Measurement of thermal stress-induced deformation of electronic circuit boards

A combined method of 3D digital image measurement and thermography was developed to measure thermal stress-induced deformation of components as early as the design phase. Read more →

Bitsensing launches autonomous vehicle 4D imaging radar

Bitsensing launches autonomous vehicle 4D imaging radar

The goal is for autonomous fleets to accelerate a path to commercialization. Read more →

Sub-nanometer resolution AOTF for spectral imaging

CASTECH, Inc.

Sub-nanometer resolution AOTF for spectral imaging

≤0.25 nm resolution and 85% diffraction efficiency enable precise wavelength selection for hyperspectral imaging, industrial inspection and optical measurement systems.
 

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New Si PIN photodiode for high-speed YAG laser detection

New Si PIN photodiode for high-speed YAG laser detection

The photodiode is engineered to support users requiring accurate, high-speed detection in yttrium aluminum garnet (YAG) laser and analytical instrumentation. Read more →

   

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