Mouser Electronics

Amphenol FCI ExaMax® high speed interconnect system

Amphenol FCI ExaMAX® high-speed interconnect system is scalable from 25 Gb/s up to 56 Gb/s signal speed and is compatible with various system architectures, including backplane, midplane, cables backplane and mezzanine applications.
 

Intel joins Tesla's Terafab project

The company will help with refactor silicon technology. Read more →

SEMI: Fab equipment spending to reach $133 billion in 2026

Data center and edge device demand pushing expansion. Read more →

AGC Chemicals Americas, Inc.

Powering the four core functions of data center infrastructure

AGC offers solutions supporting the four core functions of data centers: power infrastructure, cooling systems, air handling/filtration, and network communications. Advanced resins, coatings, and materials effectively protect critical components.
 

AI illusion: Market growth hides component shortages and unpredictability — Q&A with Dale Ford of ECIA

AI chip demand drives semiconductor growth, but memory shortages, tariff uncertainty and weak component markets complicate the industry outlook. Read more →

Element Materials Technology

AI data centers demand proven performance

Validate infrastructure with Element to reduce risk, deployment and protect uptime in AI-driven environments.