Advanced nuclear has what AI data centers need. Can it arrive in time?
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View web version 10 September 2026 — Issue 2 | Vol 6
 
Data Centers - GlobalSpec
 

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Advanced nuclear has what AI data centers need. Can it arrive in time?

Advanced nuclear has what AI data centers need. Can it arrive in time?

AI is forcing a collision between industries on radically different clocks: Hyperscale data centers can be planned and deployed in a matter of years, while new nuclear power plants often take a decade or more to license, finance and build. Read more →
Connecting the world with custom cable

New England Wire Technologies Corporation

Connecting the world with custom cable

From Litz wire to micro-miniature coaxial cables, New England Wire Technologies has been designing and manufacturing custom cables for 125 years. Dream beyond today's technology! Contact us today!
 

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Optical solutions for next-generation data centers

Amphenol Communications Solutions

Optical solutions for next-generation data centers

Amphenol delivers comprehensive portfolio of optical solutions from 1.6T transceivers and XPO-LPO to active optical cables and fiber connectivity, enabling scalable, low-latency connectivity for next-generation AI and hyperscale data centers.
 

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Don't let lead times delay fiber certification

Electro Rent

Don't let lead times delay fiber certification

Keep projects moving. Rent OLTS equipment from EXFO, Fluke Networks, and VIAVI with fast, flexible access from one trusted source.
 

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Infineon bets big on SIVR with C2i buy

Infineon bets big on SIVR with C2i buy

The acquisition clears the way for more software-defined smart power stages for AI processors. Read more →
Why liquid cooling penetration is already over 50% in AI infrastructure

Why liquid cooling penetration is already over 50% in AI infrastructure

The progression of AI chip performance is causing the need to move to the technology rapidly. Read more →
Can microfluidics solve the biggest data center cooling challenges?

The Lee Co.

Can microfluidics solve the biggest data center cooling challenges?

As AI workloads grow, cooling demands are rising fast. Discover how precision fluid control helps direct-to-chip liquid cooling maximize performance, efficiency, and long-term system reliability.
 

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Break PCIe Gen6 PCB barriers with flexible CDFP connectivity

TE Connectivity ™

Break PCIe Gen6 PCB barriers with flexible CDFP connectivity

TE Connectivity’s CDFP PCIe Gen6 x16 OTB cable assembly delivers standardized, high-integrity connectivity between CDFP and internal connectors, enabling flexible designs, customization, and support for evolving near-package connector architectures.
 

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EMI solutions for data center and server applications

TE Connectivity ™

EMI solutions for data center and server applications

Network systems should account for electromagnetic compatibility as a potential problem to achieve maximum performance and efficiency in data center applications.
 

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