High-bandwidth flash in AI memory architectures
 
View web version 9 September 2026 — Issue 9 | Vol 21
 
Electronic Design Solutions - GlobalSpec
 

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High-bandwidth flash in AI memory architectures

High-bandwidth flash in AI memory architectures

HBF provides high capacity to AI processors for storing model weights for inference tasks. Read more →

RF wireless system digital twins and automation for AI

Remcom (USA)

RF wireless system digital twins and automation for AI

Discover how RF digital twins bridge full-wave EM simulation, propagation modeling and AI to reduce design iterations and accelerate wireless development.
 

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Bluetooth and motor control by one MCU: PIC32 BZ6

DigiKey

Bluetooth and motor control by one MCU: PIC32 BZ6

PIC32-BZ6 enables a single MCU to deliver robust wireless connectivity and precise motor control by combining Bluetooth and control peripherals to simplify system design while reducing cost, power and complexity.
 

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Surface-mount, high-voltage optocoupler — introducing VMI's new OCSM50

Voltage Multipliers, Inc.

Surface-mount, high-voltage optocoupler — introducing VMI's new OCSM50

This epoxy-molded optocoupler features 5 kV Vrwm, high gain, high isolation, in a small footprint. VMI is ISO9001:2015 certified. We manufacture and 100% test all our products at our facility.
 

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Infineon’s bets big on SIVR with C2i buy

Infineon's bets big on SIVR with C2i buy

The acquisition clears the way for more software-defined smart power stages for AI processors. Read more →

Why liquid cooling penetration is already over 50% in AI infrastructure

Why liquid cooling penetration is already over 50% in AI infrastructure

The progression of AI chip performance is causing the need to move to the technology rapidly. Read more →

Exceptional thermal conductivity with the EPO-TEK® EK1000 family

Epoxy Technology

Exceptional thermal conductivity with the EPO-TEK® EK1000 family

Deliver >15 W/m·K thermal conductivity, excellent bonding and solder replacement for photonics, microelectronics and defense; a low-outgassing version meets MIL-STD-883/5011.
 

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