TechInsights Teardown: Lenovo Legion Go
 
View web version 6 July 2026 — Issue 7 | Vol 21
 
Consumer Electronics - GlobalSpec
 

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TechInsights Teardown: Lenovo Legion Go

TechInsights Teardown: Lenovo Legion Go

This article provides a partial deep dive into the handheld gaming system. Read more →

Positronic precision machined one-piece banded backshells

DigiKey

Positronic precision machined one-piece banded backshells

X* Series lightweight aluminum backshells deliver 360° EMI shielding, durable one-piece construction and reliable performance, with a variety of entry options, sizes and profiles to support demanding applications.
 

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Littelfuse launches ultra-low power omnipolar TMR switch sensor

Littelfuse launches ultra-low power omnipolar TMR switch sensor

The switch sensor enables high-sensitivity magnetic field sensing with 1.5 µA current draw for always-on, battery-powered designs. Read more →

Accelerating PCB protection at scale

Accelerating PCB protection at scale

Ultra-fast curing technologies enabling high-throughput, energy-efficient manufacturing without compromising protection or quality. Read more →

High power harmonic load pull for GaN devices

Maury Microwave

High power harmonic load pull for GaN devices

Combining passive pre-matching with controlled active impedance synthesis enables accurate high-VSWR harmonic load pull measurements while minimizing injected power. This approach delivers practical, repeatable characterization of high-power GaN devices under operating conditions closely reflecting real amplifier applications.
 

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ROHM launches an ultra-compact wireless power chipset for wearables

ROHM launches an ultra-compact wireless power chipset for wearables

The chipset is compatible with Near Field Communication technology for compact wearables such as smart rings and smart bands, as well as peripheral devices like smart pens. Read more →

   

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