The optical interconnect boom has a manufacturing problem
 
View web version 22 May 2026 — Issue 5 | Vol 21
 
Electronic Test Equipment - GlobalSpec
 

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The optical interconnect boom has a manufacturing problem

The optical interconnect boom has a manufacturing problem

AI-driven demand for 800G and 1.6T transceivers is tripling the market — and InP laser capacity is struggling to keep pace. Read more →

Beamwidth and directivity shape accurate RF and EMC antenna testing

A.H. Systems Inc.

Beamwidth and directivity shape accurate RF and EMC antenna testing

Antenna beamwidth directly impacts RF testing accuracy by controlling signal coverage and directivity. Narrower beamwidth increases antenna gain and focus, while wider beamwidth improves coverage consistency across EMC and compliance testing environments.
 

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High-performance Si PIN photodiode for FSO, laser and analysis applications

High-performance Si PIN photodiode for FSO, laser and analysis applications

With strong infrared sensitivity and high response, this model expands the toolkit available for optical measurement, free space optical (FSO) communication and dimensional analysis. Read more →

Bluetooth protocol analysis with 880 MHz of concurrent capture across higher frequency bands

Bluetooth protocol analysis with 880 MHz of concurrent capture across higher frequency bands

The Frontline X700 delivers unprecedented visibility into Bluetooth operation in emerging higher-frequency bands and simultaneously extends Wi-Fi 7 Multi-Link Operation analysis across three bands. Read more →

High-speed RF power measurements in laboratory and manufacturing environments

LadyBug Technologies LLC

High-speed RF power measurements in laboratory and manufacturing environments

Accurate RF power measurement is an important part of product development and manufacturing testing for systems and components with communication modules. Learn more about the significant advantages offered by high-performance pulse power sensors in both laboratory and manufacturing situations.
 

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Measurement of thermal stress-induced deformation of electronic circuit boards

Measurement of thermal stress-induced deformation of electronic circuit boards

A combined method of 3D digital image measurement and thermography was developed to measure thermal stress-induced deformation of components as early as the design phase. Read more →

The perfect DRG horn for immunity and emissions testing

A.H. Systems Inc.

The perfect DRG horn for immunity and emissions testing

A.H. Systems' 170 MHz-3 GHz DRG horn offers high gain, low VSWR, 800 W power handling for EMC testing. TSC-570 case available upon request.
 

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Multi-purpose broadband noise module

kTB Solutions

Multi-purpose broadband noise module

Noise modules deliver high output power, flat response and wideband coverage from 1 MHz to 18 GHz for jamming, optical power combining and calibration.
 

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