Fusion rocket test paves way for superfast interplanetary travel
Fuji Electric Corp. of America
 
View web version 15 July 2026 — Issue 15 | Vol 21
 
Electronic Components - GlobalSpec
 

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Fusion rocket test paves way for superfast interplanetary travel

Fusion rocket test paves way for superfast interplanetary travel

Pulsar Fusion’s 'first plasma' success seen as the first step toward a sustained fusion reaction. Read more →

T521 capacitors available now for immediate shipping at Mouser

Mouser Electronics

T521 capacitors available now for immediate shipping at Mouser

Assuring reduced failure risk, the KEMET T521 high-voltage polymer tantalum capacitors deliver high voltage stability, low ESR and long operational life for reliable power management designs.
 

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Forecast semiconductor costs before they hit your BOM

TechInsights Inc.

Forecast semiconductor costs before they hit your BOM

Track historical and forward-looking pricing across thousands of semiconductor categories with Component Price Landscape, helping design and sourcing teams' budget accurately through tariff and supply cycles.
 

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ECIA: 5 year high for electronic components market sentiment

ECIA: 5 year high for electronic components market sentiment

ECIA said the results are surprising since May predictions called for the average index to drop by 15 points. Despite the high, survey participants expect to see a drop in July. Read more →

Intel Foundry breaks ground on Santa Clara facility

Intel Foundry breaks ground on Santa Clara facility

The expansion is part of Intel’s larger investment in the semiconductor ecosystem in the U.S. and increases the company’s semiconductor manufacturing prowess. Read more →

Non-cytotoxic, silver filled epoxy

Master Bond, Inc.

Non-cytotoxic, silver filled epoxy

Master Bond EP77M-FMed is an electrically and thermally conductive adhesive that meets the ISO 10993-5 requirements and was designed for use in the assembly of medical devices.
 

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SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion

SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion

For the first time, spending on 300 mm fab equipment for the memory sector will surpass $50 billion, driven by AI demand for high bandwidth memory, DDR5 and data storage. Read more →

Advanced HMI enclosures for modern industrial control

Rolec Enclosures Inc.

Advanced HMI enclosures for modern industrial control

ROLEC HMI enclosures combine sleek design, IP65 protection and modular aluminum profiles — perfect for machine control and automation systems.
 

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Miniature 2.0 x 1.6 mm differential S1A oscillator delivers ultra-low jitter

Aker Technology USA Corporation

Miniature 2.0 x 1.6 mm differential S1A oscillator delivers ultra-low jitter

100–160 MHz differential HCSL/LVPECL/LVDS, ±25 ppm, -40° C to +125° C, 2.0 x 1.6 mm for networking and automotive.
 

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