Packaging materials may be the next AI roadblock
 
View web version 2 September 2026 — Issue 18 | Vol 21
 
Electronic Components - GlobalSpec
 

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Packaging materials may be the next AI roadblock

Packaging materials may be the next AI roadblock

ABF still corners the market in semiconductor packaging, but new material sets for PCBs, substrates and SLPs are being brought to market. Read more →

The intelligent switch: Faster, safer and smarter than the fuse or relay

Rutronik Elektronische Bauelemente GmbH

The intelligent switch: Faster, safer and smarter than the fuse or relay

See why smart power switches beat traditional fuses and relays, offering faster response, diagnostics, software-defined control and safety, plus real-world examples and fail-operational design benefits.
 

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ECIA: Summer slump hits electronic component sales

ECIA: Summer slump hits electronic component sales

But July still beat sales expectations. Read more →

Lam Research to invest $3 billion on R&D lab network

Lam Research to invest $3 billion on R&D lab network

The investment will be spread out over the next five years. Read more →

Rad-tolerant atomic clock unveiled for new space applications

Rad-tolerant atomic clock unveiled for new space applications

Microchip’s expanding portfolio of space ICs targets SATCOM, alternative navigation and Earth imaging. Read more →

Micro Crystal RTCs: Precision timing for smarter, reliable designs

Micro Crystal AG

Micro Crystal RTCs: Precision timing for smarter, reliable designs

Reduce power consumption using ultra-low power RTC modules and ensure accurate timekeeping for IoT, medical and industrial devices.
 

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