Teledyne e2v Semiconductors

A processor for next-generation space systems

Modern missions require processors capable of handling large data volumes directly in orbit while remaining reliable in harsh environments. New space processors target these dual challenges, making them ideal for next-generation systems.
 

Three-layer armor defends vehicles against mines, rockets, drones

The systems from Plasan — dubbed LAPS, ATHENA and TAPS — each concentrates on a specific weakness that traditional armor struggles to address without the addition of extra weight. Read more →

New heat-compressed silk material beats wood in strength, challenges Kevlar, carbon fiber

The resulting material performed comparable to advanced composites in terms of strength and toughness, while also remaining biocompatible and tunable for medical applications. Read more →

Micross Components, Inc.

The key to advanced packaging supply chains for onshore microelectronics production

In a recent webinar, experts from Micross discussed the resources and requirements to develop an efficient and reliable advanced packaging supply chain for U.S.-based microelectronics production.
 

US scientists develop new way to detect chemical weapons, nerve agents

According to its developers, the new approach can detect pinacolyl alcohol (PA), which is a unique marker for the nerve agent Soman in environmental samples. Read more →

Nicomatic North America

Mission-critical connectivity

Maximize performance while reducing size and weight with modular CMM connectors.