Micro-Epsilon Group

Take vacuum process control to the next level

confocalDT high-temperature sensors deliver nanometer resolution, low outgassing and reliable wafer gap and layer thickness measurements up to 200° C, with UHV-compatible options for demanding vacuum processes.
 

Particle Measuring Systems

20 nm yield protection

At 20 nm, contamination drives yield, not just performance. Particles evade traditional monitoring, quietly damaging process integrity. Gain complete visibility and control across your water and chemical processes.
 

Vaisala

On-demand: Specify dew point measurement for semiconductor dry gases

Learn best practices for accurate dew point measurement in ultra-dry gases and wafer testing to reduce contamination risk, improve reliability, support sensor selection and support confident specification decisions.
 

First high-volume 300 mm GaN to be established in Europe

Infineon Technologies will invest about $1.23 billion in the project by 2034. Read more →

Applied Materials unveils its $5 billion EPIC Center

It is called the world’s largest facility dedicated to collaborative semiconductor process technology and manufacturing equipment R&D. Read more →

Vaisala

Design humidity control into semiconductor manufacturing environments

Explore where accurate humidity measurement supports contamination control, process stability, product quality and informed design decisions for semiconductor facilities, process areas and gas monitoring systems.
 

Infineon shores up SiC supply security with Wolfspeed

An agreement will transform the existing relationship from 150 mm wafers to 200 mm substrate technology. Read more →

ETEL S.A.

METIS HP: High-speed stability with high straightness motion system

METIS HP delivers exceptional speed stability and dynamic straightness for high-end tools, handling panels up to 600 by 600 mm.
 

Beijing Grish Hitech Co., Ltd.

CMP slurry selection for different wafer materials

Semiconductor industry CMP slurry guide matches wafer materials for higher removal rate and quality.
 

Fountyl Technologies Pte. Ltd.

Ceramic chucks for semiconductor wafer clamping and particle control

Alumina and silicon carbide chucks deliver ±1% vacuum uniformity, low particle risk and stable clamping in semiconductor manufacturing.