About this eNewsletter
Frequency: 18 issues/year
Description: Engineering360's Electronic Product Design Newsletter offers subscribers a wealth of information on products and services such as: adhesives, coatings and sealants, computers and computer software, contract manufacturing, electronic components, embedded systems, motors and motion control, plastics/elastomers, pumps, valves, and filters, and test and instrumentation. Subscribers of this publication include design and development engineers, as well as purchasing and other technical professionals.
Markets Served: Aerospace; Computers; Consumer Electronics; Automotive; Communications; Medical Equipment; Industrial Controls
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About Our eNewsletters
GlobalSpec offers over 60 eNewsletters designed to keep you abreast of news and information in your industry.
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Covers new technologies impacting the aerospace industry.
Serves manufacturers of consumer, commercial, business, and medical appliances, as well as the design and engineering firms, product development, and industrial design firms supporting this industry segment.
Helps engineers specify optimum parts and select best fabrication practices to improve performance, lower cost, and speed production of today's passenger cars, trucks, and off-road vehicles
Includes information about acquisition of signals and waveforms, and processing of the signals to obtain desired information.
Defense & Security Technology
Updates subscribers with the latest developments across all technology sectors relevant to defense and security.
Design & Analysis Software
Keeps subscribers up to date on four main categories of design and analysis software: Computer Aided Design, Computer Aided Manufacturing, Computer Aided Engineering, and Product Lifecycle Management.
Offers subscribers a wealth of information on man-machine interface methods, including LED and LCD displays, flat panels, touch screens, panel meters, imaging workstations and analysis, and computer workstations used to monitor manufacturing processes.
Electronic Test Equipment
Keeps subscribers up-to-date on the field of electronic testing, from test instruments and PCB tests, to test and inspection strategies.
Offers valuable information on tools and strategies used to keep all engineering departments within an organization “on the same page.”
Offers a wealth of information for professionals working in maintenance, repair, and operations of industrial plants.
Medical Equipment Design
Tracks trends and product news in the medical equipment field.
Networking & Communications
Focuses on networking hardware and software used to manage digital communication networks.
Plant & Facilities Engineering
Covers industry trends and events, equipment, and techniques related to plant and facilities engineering (also known as maintenance engineering or reliability engineering).
Plastics FabricationSee More
Covers new methods for making parts out of plastics as well as improvements to “tried-and-true” methods, such as molding, extrusion, and machining.
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Past Issues of this eNewsletter
Volume 13 - Issue 7 - 05/09/2018
Laser Marking for Traceability and Asset Management; Streamline Production of the Smallest, Most Complex Electronic Metal Stampings; Bring Efficiency and Automation to Enclosure Customization; Energy Powers More Than Appliances in the Connected Home; Complete Electronics Assembly Service; Why Pay for Unnecessary Power to Generate Required Field Strengths?
Volume 13 - Issue 6 - 04/25/2018
White Paper: Composites & Metals: Complementary 3D Printing; Reduce the Risk of Noncompliance eBook; Why Pay for Unnecessary Power to Generate Required Field Strengths?
Volume 13 - Issue 5 - 04/11/2018
Selection and Use of Fabrication Ready Magnetic Shielding Alloys; Meeting the Need for Miniature Cooling; Reducing Voids is a Function of Partnership; 256GB Automotive UFS NAND Outperforms Automotive e-MMC; Your Source for Mission Critical Components
Volume 13 - Issue 4 - 03/28/2018
Dual-function Chokes Address Differential and Common-mode Noise in a Single Component; 3.0 V Composite Electrode for Energy Storage Applications; Inside a New Architecture for USB-C Applications; Environmental Testing and Analysis Services
Volume 13 - Issue 3 - 02/28/2018
Enhancing Simple PCB Functions with Low-cost MCUs; Better Durability and More Accessories Than Unibody Enclosures; How to Automate the Chip Removal Process with the Right Conveying System
Volume 13 - Issue 2 - 02/14/2018
See How Purdue Engineering Online Can Advance Your Career; Eight Port PoE Solution Meeting IEEE 802.3at-2012 at Mouser; The New Way to Encapsulate; Detection and Avoidance of Counterfeit Components: Understanding IT&A Methods; HMI User Interface Assemblies
Volume 13 - Issue 1 - 01/24/2018
Virginia Tech Engineer — The College of Engineering's Premier Magazine; Miniature Motion Solutions for Performance-critical Applications; One Part Epoxy for Specialty Dam-and-Fill Encapsulation; JIC Junction Enclosure; Miniature Programmable High Voltage Supply Provides Up to 8,000 Vdc; ReelFast® Surface Mount Spring-loaded Captive Panel Screws; Deep-drawn Components for Electronics
Volume 12 - Issue 18 - 12/27/2017
White Paper: The Future of Performance and Affordability; Wacker Silicone Bonding and Sealing
Volume 12 - Issue 17 - 11/22/2017
Smart Measurements for Smart Industries – Humidity Measurement in Industrial Applications; Norseal® K10-TS: Super Thin Cushion Foams; Meeting the Need for Miniature Cooling; Cobham Modular Platform
Volume 12 - Issue 16 - 11/08/2017
Mouser Stocks IDT Flow Sensors; ESPEC BTZ-4200 Compact Temperature Cycling Chambers; New RGB Sealed Contact Switches; Wireless Power Authentication and Data Transfer Without Additional Coils; PIC18F "K42" Family; User Interface Assemblies
Volume 12 - Issue 15 - 10/25/2017
Next-gen PC Mount Split Pack™ Transformers; Electromagnetic Compatibility Standards (Active and Archive) Collection: VuSpec™; 3D Printing Costs and Business Implications Across the Product Life Cycle
Volume 12 - Issue 14 - 10/11/2017
Fundamentals of Designing with Adhesives; Safe Coolant Pumping for Electronic Devices; Diamond Wheels for IC Grinding; The World's Most Advanced Hearables Use Rechargeable Silver-Zinc Battery Technology
Volume 12 - Issue 13 - 09/27/2017
Norseal Super Thin Cushion Foam for Electronics; Next-gen PC Mount Split Pack Transformers; Fast and Accurate 3D Scanning: The New Nikon ModelMaker H120 Handheld Scanner
Volume 12 - Issue 12 - 09/13/2017
Get Magnetic Shielding Wiring Samples in Test Lab Kits; Boost PROFIBUS RS-485 Robustness with Isolation; Register Today for Telit IoT Innovation Summit; Thermally Conductive Silicone Adhesive — SEMICOSIL® 975 TC; Innovative System Helps Aging Loved Ones Live Independently at Home; Factory Direct Enclosures to Save You Money
Volume 12 - Issue 11 - 08/23/2017
LabVIEW — See It. Solve It.; Three-channel Digital Isolators with 8000 V Peak Isolation; IRISO's 10126 Series Connector Does Not Have a ‘Napoleon Complex'; Diamond Wheels for IC Grinding; Creating Value Together
Volume 12 - Issue 10 - 07/26/2017
Expedite Development of Products with Power Electronic Systems; Polycarbonate Enclosures; Highly Conductive Silver Inks; New RGB Sealed Contact Switches; Compact SMD Power Inductor for Automotive
Volume 12 - Issue 9 - 06/28/2017
Next-gen PC Mount Split Pack™ Transformers; Electronic Equipment Failures: Cause, Effect, and Resolution; Multiscale and Multidomain Simulation of Electrical Power Systems — Presentation; Thermocouple Welding Saves Time, Improves Results; Automotive NFC Readers for Keyless Entry; Miniature Regulated High Voltage DC/DC Converter Produces 8000 Vdc; SEMICOSIL® 915 HT — High Heat Resistant Silicone Gel; New Mechanical HALT System — LN2 Option; Protect Electronics with Custom Enclosure G
Volume 12 - Issue 8 - 05/24/2017
Switchcraft's Con-X Sealed Harsh Environment Connectors; Himalaya 60 V Buck Enables Rapid Compliance to IEC/SIL; 22 nA Low Power RTC; ST25DV Dynamic NFC/RFID Tag IC Series
Volume 12 - Issue 7 - 05/10/2017
DOE Level VI AC-AC Wall Transformers; Wireless Charging Solutions in Stock at; White Paper: Using Loadability Studies to Comply with NERC PRC-025; A Thermal Management Solution for State-of-the-Art Electronics; White Paper: Your Design Problems, Answered; NEMA 4X Enclosures; Thermal Interface Material HC 5.0; Board Mount AC-DC Power Supplies from 3 to 20 W; Packaging Containers
Volume 12 - Issue 6 - 04/26/2017
Serialize and Brand Electronics with Epilog; Best Practices for Materials Driven Product Design and PLM; Four Factors in Electrical Contract Manufacturing; A Must-read for Electronics Manufacturers and Their Suppliers; New RGB Sealed Contact Switches; Wireless Digital Switches & Sensors: New Control Possibilities
Volume 12 - Issue 5 - 04/12/2017
DOE Level VI AC-AC Wall Transformers; Co-NETIC® AA SPIRA-SHIELD Conduit Protects Cabling; 10 Labels That Solve Engineering Challenges; Why Sample When 100% X-ray Inspection Is Possible?; ALPHA® Assembly Materials for LED Applications; Norseal® K10-TS: Super Thin Cushion Foams
Volume 12 - Issue 4 - 03/22/2017
See Your Product Develop in a Whole New Way; How Are You Meeting Your Enterprise IoT Implementation Challenges?; Meeting the Need for Miniature Cooling; Factory Direct Modular Enclosures; Advance Your Career Today!; SEMICOSIL® 988 Silicone Adhesive
Volume 12 - Issue 3 - 02/22/2017
Onlinecomponents.com Presents ebm-Papst's ACi4400 Fans; 10 Labels That Solve Engineering Challenges; Download LabVIEW; EMI / RFI / ESD Shielding Gaskets and Seals; Brushless DC Magnetic Drive Circulation Pump; GAP PAD™ Thermal Interface Material HC 5.0; Iron Core DC Micro Motors; Industry Leader in Highly Reliable Contract Manufacturing
Volume 12 - Issue 2 - 02/08/2017
Next-gen PC Mount Split Pack Transformers; Natural and Painted Diecast 1590 Series Enclosures; Serialize and Brand Electronics; Design for the Freedom of Additive Manufacturing; Raise the Bar for Pin Header Technology; IP66/67 Electrical Control Box (Enclosure); Protect Electronics with Custom Enclosure Gaskets; Tech Insider On-demand Webinar: Design and Verification Challenges
Volume 12 - Issue 1 - 01/25/2017
Innovative Design Solutions; Need a Solid State or Electromechanical Relay Solution?; Mouser Carries High Reliability, Heat-resistant Chip Capacitors; High Strength Re-workable Battery Tape; A Single Source for Electronic Benchtop Products; 30 W 1000 Vdc Fully Programmable DC/DC Converter; Polycarbonate Enclosures; PEM® Micro Technology Perfect for Compact Electronic Assemblies; Deep-drawn Components for Electronics; Innovations in Laser Marking Technology
Volume 11 - Issue 18 - 12/28/2016
Innovative Design Solutions; Mouser Carries Ultra-low Power Sub-1GHz/2.4GHz Wireless MCUs; Transform Product Development with Easy Access to PLM; White Paper: Selecting Coupled Inductors for SEPIC Applications; Specification Guide: Transformers; Webinar: Finding the Right Sensor for Automotive, Industrial, and Consumer Designs
Volume 11 - Issue 17 - 11/23/2016
Next-gen PC Mount Split Pack Transformers; Buy the Breadth of Bourns® Magnetic Products; Mean Well USA Interchangeable Medical Adaptor; Identification Tasks Finished Flawlessly; Complimentary Digital Publication: Optimize Production for Agile Manufacturing; Electronics 360 Webinar - 3D Printing: Simplifying Your Designs and Workflow; Specification Guide: Product and Component Testing Services
Volume 11 - Issue 16 - 11/09/2016
Innovative Design Solutions; Serialize and Brand Electronics with Epilog; Switchcraft EN3® Series Weathertight Connectors at Onlinecomponents.com; Full Service Electronic Manufacturing; SEMICOSIL® 988 Silicone Adhesive; One Source for All Your Spring Requirements; Meeting the Need for Miniature Cooling; IP66/67 Enclosures