About this eNewsletter
Frequency: 18 issues/year
Description: Engineering360's Electronic Product Design Newsletter offers subscribers a wealth of information on products and services such as: adhesives, coatings and sealants, computers and computer software, contract manufacturing, electronic components, embedded systems, motors and motion control, plastics/elastomers, pumps, valves, and filters, and test and instrumentation. Subscribers of this publication include design and development engineers, as well as purchasing and other technical professionals.
Markets Served: Aerospace; Computers; Consumer Electronics; Automotive; Communications; Medical Equipment; Industrial Controls
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About Our eNewsletters
GlobalSpec offers over 60 eNewsletters designed to keep you abreast of news and information in your industry.
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Covers new technologies impacting the aerospace industry.
Alternative & Renewable Energy
Focuses on energy savings and the environment, and explores new ways to generate electricity.
Serves manufacturers of consumer, commercial, business, and medical appliances, as well as the design and engineering firms, product development, and industrial design firms supporting this industry segment.
Helps engineers specify optimum parts and select best fabrication practices to improve performance, lower cost, and speed production of today's passenger cars, trucks, and off-road vehicles
Defense & Security Technology
Updates subscribers with the latest developments across all technology sectors relevant to defense and security.
Offers subscribers a wealth of information for design engineers and other technical professionals using electric components as their primary building blocks in consumer and commercial products.
Offers subscribers a variety of information on electronic design products and processes for application in computers, communications equipment, consumer electronics, and industrial systems.
Networking & Communications
Focuses on networking hardware and software used to manage digital communication networks.
Wireless TechnologySee More
Reports on widely used applications in computer networking and communications.
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Past Issues of this eNewsletter
Volume 13 - Issue 16 - 11/14/2018
Custom Magnetic Component Buyer's Guide; Mouser Carries Class-D Power Inductors for Audio Design; Efficiently Achieving ASIL-D Compliance Using NoC Technology; Get Your Testing, Service, Support, and Education Accomplished with One Partner; Ultra-thin Flexible Heaters; For Speed, Accuracy, and Efficiency, You Can't Beat AR Systems; Five Key MMIC LNA Choices That Can Make or Break a Receiver Design
Volume 13 - Issue 15 - 10/24/2018
Achieve a New Level of BOM Intelligence; Validating the Transportations Solutions of Tomorrow; The Importance of Jitter in High Performance Design; Four Questions to Guide Your Laboratory Centrifuge Selection; Drawn Fiber Polymers: Chemical and Mechanical Features
Volume 13 - Issue 14 - 10/10/2018
HCLA Replacement Analog and Digital Pressure Sensors: ELVR Series; Quick and Easy Cellular IoT Application Development; Achieve a New Level of BOM Intelligence; Transform Your Food Analysis Results from Acceptable to Exceptional; Get Started, Transform, or Buy for Your Bill of Materials; SWaP-C Benefits of Designing with Positive Gain Slope MMIC Amps
Volume 13 - Issue 13 - 09/26/2018
White Paper: Transform Your Food Analysis Results from Acceptable to Exceptional; Achieve a New Level of BOM Intelligence; Comparing Test Methods for Sodium Determination; Need Smoother Steering? Improved Yoke Design Can Help; A Focus on Optical Kit Encoders and Modular Magnetic Encoders; SWaP-C Benefits of Designing with Positive Gain Slope MMIC Amps
Volume 13 - Issue 12 - 09/12/2018
AC Current Sensors for Every Application; Selection and Use of Fabrication Ready Magnetic Shielding Alloys; Contemporary Anti-corrosion Technology for Automotive Hinges; Arria 10 SoC SOM and Design Support; Need Smoother Steering? Improved Yoke Design Can Help; A Focus on Optical Kit Encoders and Modular Magnetic Encoders; Enhanced Atmospheric Gas Sensing Through Reduced Electronic Noise
Volume 13 - Issue 11 - 08/22/2018
Dual-function Chokes Address Differential and Common-mode Noise in a Single Component; Mouser Carries Low-power Active Mixer Delivering 7 GHz Bandwidth; Download White Paper: How to Create an IoT Edge System Prototype; Modular Enclosure Buyer's Guide: Download Now; Meeting the Need for Miniature Cooling; Piezo-resistive Force Sensors: The Hidden Champions in Medical Devices; Complex Embedded Design Made Quick, Easy, and Enduring
Volume 13 - Issue 10 - 07/25/2018
Dual-function Chokes Address Differential and Common-mode Noise in a Single Component; The Benefits of Scalable Digital Point-of-Load Solutions; The Future of Automotive Lightweighting with Tolerance Ring Stator Mounting Solutions; Shhh! Using Digital Current Loops to Significantly Reduce Step Motor Noise; A Surefire Way Gasket Manufacturers Can Reduce Their Carbon Footprint; Comparing Test Methods for Sodium Determination; Increase Revenue with Closer Human-Robot Collaboration
Volume 13 - Issue 9 - 06/27/2018
Virginia Tech Engineer — The College of Engineering's Premier Magazine; Today's Wearable Medical Devices Require Powerful, Safe, and Sustainable Batteries; Testing Sensor Fusion for Autonomous Vehicles; High Voltage DC/DC Converters with Programmable 5 Kvdc Output; Reliable Protection of Electronics in Ordinary and Hazardous Locations; Tackle Your Testing and Service Needs with One Partner; How to Make Industrial Water and Wastewater Treatment Part of Your Profit Strategy
Volume 13 - Issue 8 - 05/23/2018
Mouser Stocking Connectors with IP67 Environmental Seal Retention; Why Pay for Unnecessary Power to Generate Required Field Strengths?; Testing Sensor Fusion for Autonomous Vehicles; Make Industrial Water and Wastewater Treatment Part of Your Profit Strategy; Learn How to Choose the Right LDO for Your Application; Linear vs Limiting Optical Transceivers
Volume 13 - Issue 7 - 05/09/2018
Laser Marking for Traceability and Asset Management; Streamline Production of the Smallest, Most Complex Electronic Metal Stampings; Bring Efficiency and Automation to Enclosure Customization; Energy Powers More Than Appliances in the Connected Home; Complete Electronics Assembly Service; Why Pay for Unnecessary Power to Generate Required Field Strengths?
Volume 13 - Issue 6 - 04/25/2018
White Paper: Composites & Metals: Complementary 3D Printing; Reduce the Risk of Noncompliance eBook; Why Pay for Unnecessary Power to Generate Required Field Strengths?
Volume 13 - Issue 5 - 04/11/2018
Selection and Use of Fabrication Ready Magnetic Shielding Alloys; Meeting the Need for Miniature Cooling; Reducing Voids is a Function of Partnership; 256GB Automotive UFS NAND Outperforms Automotive e-MMC; Your Source for Mission Critical Components
Volume 13 - Issue 4 - 03/28/2018
Dual-function Chokes Address Differential and Common-mode Noise in a Single Component; 3.0 V Composite Electrode for Energy Storage Applications; Inside a New Architecture for USB-C Applications; Environmental Testing and Analysis Services
Volume 13 - Issue 3 - 02/28/2018
Enhancing Simple PCB Functions with Low-cost MCUs; Better Durability and More Accessories Than Unibody Enclosures; How to Automate the Chip Removal Process with the Right Conveying System
Volume 13 - Issue 2 - 02/14/2018
See How Purdue Engineering Online Can Advance Your Career; Eight Port PoE Solution Meeting IEEE 802.3at-2012 at Mouser; The New Way to Encapsulate; Detection and Avoidance of Counterfeit Components: Understanding IT&A Methods; HMI User Interface Assemblies
Volume 13 - Issue 1 - 01/24/2018
Virginia Tech Engineer — The College of Engineering's Premier Magazine; Miniature Motion Solutions for Performance-critical Applications; One Part Epoxy for Specialty Dam-and-Fill Encapsulation; JIC Junction Enclosure; Miniature Programmable High Voltage Supply Provides Up to 8,000 Vdc; ReelFast® Surface Mount Spring-loaded Captive Panel Screws; Deep-drawn Components for Electronics
Volume 12 - Issue 18 - 12/27/2017
White Paper: The Future of Performance and Affordability; Wacker Silicone Bonding and Sealing
Volume 12 - Issue 17 - 11/22/2017
Smart Measurements for Smart Industries – Humidity Measurement in Industrial Applications; Norseal® K10-TS: Super Thin Cushion Foams; Meeting the Need for Miniature Cooling; Cobham Modular Platform
Volume 12 - Issue 16 - 11/08/2017
Mouser Stocks IDT Flow Sensors; ESPEC BTZ-4200 Compact Temperature Cycling Chambers; New RGB Sealed Contact Switches; Wireless Power Authentication and Data Transfer Without Additional Coils; PIC18F "K42" Family; User Interface Assemblies
Volume 12 - Issue 15 - 10/25/2017
Next-gen PC Mount Split Pack™ Transformers; Electromagnetic Compatibility Standards (Active and Archive) Collection: VuSpec™; 3D Printing Costs and Business Implications Across the Product Life Cycle
Volume 12 - Issue 14 - 10/11/2017
Fundamentals of Designing with Adhesives; Safe Coolant Pumping for Electronic Devices; Diamond Wheels for IC Grinding; The World's Most Advanced Hearables Use Rechargeable Silver-Zinc Battery Technology
Volume 12 - Issue 13 - 09/27/2017
Norseal Super Thin Cushion Foam for Electronics; Next-gen PC Mount Split Pack Transformers; Fast and Accurate 3D Scanning: The New Nikon ModelMaker H120 Handheld Scanner
Volume 12 - Issue 12 - 09/13/2017
Get Magnetic Shielding Wiring Samples in Test Lab Kits; Boost PROFIBUS RS-485 Robustness with Isolation; Register Today for Telit IoT Innovation Summit; Thermally Conductive Silicone Adhesive — SEMICOSIL® 975 TC; Innovative System Helps Aging Loved Ones Live Independently at Home; Factory Direct Enclosures to Save You Money
Volume 12 - Issue 11 - 08/23/2017
LabVIEW — See It. Solve It.; Three-channel Digital Isolators with 8000 V Peak Isolation; IRISO's 10126 Series Connector Does Not Have a ‘Napoleon Complex'; Diamond Wheels for IC Grinding; Creating Value Together
Volume 12 - Issue 10 - 07/26/2017
Expedite Development of Products with Power Electronic Systems; Polycarbonate Enclosures; Highly Conductive Silver Inks; New RGB Sealed Contact Switches; Compact SMD Power Inductor for Automotive
Volume 12 - Issue 9 - 06/28/2017
Next-gen PC Mount Split Pack™ Transformers; Electronic Equipment Failures: Cause, Effect, and Resolution; Multiscale and Multidomain Simulation of Electrical Power Systems — Presentation; Thermocouple Welding Saves Time, Improves Results; Automotive NFC Readers for Keyless Entry; Miniature Regulated High Voltage DC/DC Converter Produces 8000 Vdc; SEMICOSIL® 915 HT — High Heat Resistant Silicone Gel; New Mechanical HALT System — LN2 Option; Protect Electronics with Custom Enclosure G
Volume 12 - Issue 8 - 05/24/2017
Switchcraft's Con-X Sealed Harsh Environment Connectors; Himalaya 60 V Buck Enables Rapid Compliance to IEC/SIL; 22 nA Low Power RTC; ST25DV Dynamic NFC/RFID Tag IC Series
Volume 12 - Issue 7 - 05/10/2017
DOE Level VI AC-AC Wall Transformers; Wireless Charging Solutions in Stock at; White Paper: Using Loadability Studies to Comply with NERC PRC-025; A Thermal Management Solution for State-of-the-Art Electronics; White Paper: Your Design Problems, Answered; NEMA 4X Enclosures; Thermal Interface Material HC 5.0; Board Mount AC-DC Power Supplies from 3 to 20 W; Packaging Containers