From Handbook of Adhesives and Sealants, Volume 2
Guy Rabilloud

In 1962, Guy Rabilloud got a doctorate in chemical and physical sciences from the Nobel prize laureate of physics Louis N el. Two years later, he joined the department of fine chemicals at IFP, the French Petroleum Institute. For 30 years, he studied and developed new heat-resistant polymers for the advanced technologies, signing more than 150 patents and scientific publications. During the decade 1970 1980, he was also associate professor in macromolecular chemistry at the universities of Grenoble and Lyon. In the early 1980s, he became assistant manager of Cemota, a subsidiary of IFP created to develop, manufacture and commercialize high-performance polymers for the electronic and aerospace industries. In 1990, he spent one year as a consultant attached to the Singapore Institute of Standards and Industrial Research. Dr Rabilloud is the co-author of several books dealing with the applications of polymers, including adhesives, films and composite materials. He recently published three books providing an overview on the use of polymers in electronics, in particular conductive adhesives and heatresistant insulating films.

Keywords: Acetylene-terminated resins; Adhesive properties; Application of structural adhesives; Bismaleimide (BMI) adhesives; Coefficient of linear thermal expansion (CTE); Condensation of oligomers; Condensation prepolymers; CTBN rubbers; Degree of polycondensation (DP); Dielectric properties; Epoxy novolacs; Epoxy-phenolic adhesives; Fracture energy; Fracture toughness; Glass transition temperature; Heat of polymerisation; Heterocyclic polymers; High performance liquid chromatography (HPLC); Imidisation kinetics; Infrared spectroscopy; Isothermal thermogravimetric analysis (ITGA); Lap shear strength; Maleimide- terminated resins; Mechanical properties; Molecular weight determination; Nadimide-treated resins; Norbornene-terminated imides; Nuclear magnetic resonance; Peel...

Products & Services
Thermosets and Thermoset Resins
Thermosets and thermoset materials are crosslinked polymeric resins that are cured or set using heat or heat and pressure. They generally have a higher resistance to heat than thermoplastics.
Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Polysulphide Adhesives and Sealants
Polysulphide adhesive resins and sealants provide a flexible and chemically resistant adhesive or sealant.
Specialty Polymers and Resins
Specialty polymers and resins are proprietary polymers, resins, monomers and intermediates. They include products that are based on proprietary curing technologies or chemistries, or that are designed for specialized applications.
Conductive Compounds
Conductive compounds provide an electrically and/or thermally conductive path between components.

Topics of Interest

Christian Decker Prof. Christian Decker is Director of Research at the National Center for Scientific Research (CNRS) in France. He got his doctor in science degree in 1967 from the University of...

5.5 Aromatic Polymer Adhesives (Polyaromatics) Considerable progress has been made in improving the thermal and oxidative stabilities of organic resins at high temperatures. Heat-resistant resins and...

5.3 Alloyed or Modified (Two-Polymer) Adhesives These adhesives are important as structural adhesives especially in metal bonding. They comprise a thermosetting and a thermoplastic polymer, including...

Classifying Adhesives Adhesives are classified into thermosetting synthetic resins, thermoplastic synthetic resins, and natural resin additives based on their chemical and physical natures.

Geoff Underwood, Research Scientist Solvay Advanced Polymers LLC Alpharetta Georgia, USA Introduction Polyamide-imides are thermoplastic amorphous polymers that possess exceptional mechanical,...