Help with Active Band Pass Filters specifications:
General Characteristics
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| Filter Class | |||
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| Continuous | A continuous filter has a continuous time operation. | ||
| Switched Capacitor | Switched capacitor filters are clocked devices. The input signal is sampled at a high rate and processed discretely instead of on a continuous-time basis. | ||
| Other | Other unlisted filter classes. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Filter Order | |||
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| 1st Order | |||
| 2nd Order | |||
| 3rd order | |||
| 4th Order | |||
| 5th Order | |||
| 6th Order | |||
| 7th Order | |||
| 8th Order | |||
| Other | Other unlisted orders. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Filter Characteristic | |||
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| Bessel | Bessel filters are active filters with a passband that maximizes the group delay at zero frequency, thus showing a constant group delay in the passband. Group delay is a measurement of the time it takes for a signal to move between two points in a network. A constant group delay in the passband of filters implies that for all signals with frequencies in the passband, the time delay will be the same. This fact is important in many applications, especially audio, video and radar applications. | ||
| Butterworth | Butterworth filters are designed so that the frequency response is flat in the passband. | ||
| Chebyshev | Chebyshev filters feature a very steep roll-off, but have ripples in the passband. | ||
| Elliptic | Elliptic filters (Cauer filters) exhibit equalized ripple in both the passband and the stopband. | ||
| Gaussian | Gaussian filters produce no overshoot in response to an input step. They optimize the rise and fall times. | ||
| Legendre | Legendre filters are designed to produce the maximum roll-off rate for a given order and a flat frequency response in the passband. | ||
| Other | Other unlisted filter characteristics. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Applications | The industrial field in which the device will be used. | ||
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| General | Filters are suitable for general-purpose applications. | ||
| Audio/Video | Filters are designed for audio or video applications. | ||
| Automotive | Filters are designed for automotive applications. | ||
| Avionics | Filters are designed for avionics applications. | ||
| Commercial | Filters are designed for commercial applications. | ||
| Communications | Filters are designed for communications applications. | ||
| Computers | Filters are designed for computers. | ||
| Data Acquisition | Filters are designed for data acquisition applications. | ||
| EMI Filtering | Filters are designed for electromagnetic immunity (EMI) or electromagnetic compliance (EMC) filtering systems. | ||
| Industrial | Filters are designed for industrial applications. | ||
| Medical | Filters are designed for medical equipment and medical applications. | ||
| Military | Filters are designed for military applications. | ||
| Portable Devices | Filters are designed for portable devices such as portable digital assistants (PDA), digital cameras, and cell phones. | ||
| Ripple Attenuator | Filters are designed to trim or filter the ripple voltage produced at the output of AC-DC or DC-DC converters. | ||
| Other | Other unlisted applications. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Filter Performance
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| Supply Voltage (VS) | Supply voltage (VS) refers to the source voltage range. | ||
| Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
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| Supply Current (IS) | Source current (IS or ICC) is the current produced by the supply source when connected to the amplifier. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Input Offset Voltage (VOS) | Input offset voltage (VOS) is the differential DC voltage required at the two inputs of the operational amplifier to force the output voltage to zero. This occurs when no load is connected to the op-amp. | ||
| Search Logic: | All matching products will have a value less than or equal to the specified value. | ||
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| Lowest Cutoff Frequency (Fc) | The filter type determines the specified frequency (Fc). For band pass and band reject filters, the specified frequency is the center frequency. For low pass filters, the specified frequency is the cut-off frequency. For high pass filters, the specified frequency is the cut-on frequency. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Bandwidth | Bandwidth is the range of frequencies that filters pass with minimal attenuation or, in the case of band reject filters, maximum attenuation. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Power Dissipation | Power dissipation is the total power consumption of the device. Generally, this value is expressed in watts or milliwatts. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Isolation Voltage | The isolation voltage is the maximum voltage that can be applied to the filter without disturbing the system. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Differential Mode Attenuation | The attenuation of the filter is the ratio, at a given frequency, of the amplitude of the input signal to the filter to the output signal. It is measured in decibels (dB). Differential mode attenuation is the attenuation obtained when the filter is operating in differential mode. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Operating Temperature | Operating temperature is the value specified by a level (minTypMax) of the ambient temperature (in °C) in which this item was designed to operate. | ||
| Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
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Package Characteristics
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| Package Type | |||
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| DIP | Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). | ||
| CDIP | Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. | ||
| PDIP | Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. | ||
| DPAK | DPAK refers to a type of transistor outline package (T0-252). | ||
| CSP | Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. | ||
| SIP | SIP refers to a single inline package. | ||
| SOIC | SOIC refers to a small outline IC. | ||
| SSOP | SSOP refers to a shrink small outline package. | ||
| SOP | SOP is a small outline package. | ||
| MSOP | Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. | ||
| SOT | SOT packaging refers to a small outline transistor. | ||
| SOT23 | SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. | ||
| PSOP | PSOP refers to a power small outline package. | ||
| QFP | QFP is a quad flat package. | ||
| TO-220 | Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. | ||
| TO-3 | Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. | ||
| SC-70 | SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. | ||
| TSSOP | TSSOP refers to thin shrink small outline L-leaded packages. | ||
| QSOP | QSOP refers to a quarter size outline package. | ||
| PLCC | PLCC refers to a plastic leaded carrier. | ||
| UCSP | UCSP refers to an ultra chip scale package. | ||
| Other | Other unlisted, specialized or proprietary packages. | ||
| Search Logic: | Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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| Pin Count | Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Number of Devices in Package | This refers to the number of devices in the package. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Features
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| On-Chip ESD Protection | The chip has embedded radiation protection. | ||
| Over Current Protection | The switch has circuitry for overcurrent protection. | ||
| Radiation Tolerant | The device is radiation hardened or tolerant. | ||
| Short Circuit Protection | The switch has circuitry for short circuit protection. | ||
| Single Supply | The chip can operate with only one supply. | ||
| Hot Swap | The filter can be inserted or taken out of the system where it is installed without turning off the system. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Standards and Certifications
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| RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. | ||
| ELV Directive | End of Life Vehicles (ELV) Directive required that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum; and in solderable applications. | ||
| Other | Other unlisted, specialized, or proprietary standard or certifications. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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