Help with Crystal Filters specifications:
General Characteristics
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Filter Type | |||
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All Pass | All pass filters (phase shift filters) do not affect the amplitude of the signal. Instead, they change the phase of the signal without changing its amplitude. | ||
Band Pass | Bandpass filters are used to attenuate frequencies above and below a range of frequencies called the bandwidth or passband of the filter. Any signal with a frequency within the bandpass range passes through the filter. Any signal with a frequency outside the bandpass is reduced. | ||
Band Reject | Band reject filters (band stop filters, notch filters) are used to attenuate a range of frequencies and allow all other frequencies to pass. | ||
High Pass | High pass filters attenuate frequencies above a particular frequency called the cut-off frequency. Frequencies higher than the cut-off frequency pass easily through the filter. | ||
Low Pass | Low pass filters attenuate frequencies below a particular frequency called the cut-off frequency. Frequencies below the cut-off frequency pass easily through the filter | ||
Universal / Programmable | Universal filters can be configured by the user to function as a low pass, high pass, band pass, or band stop filter. | ||
Other | Other unlisted filter types. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Filter Order | |||
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1st Order | |||
2nd Order | |||
3rd order | |||
4th Order | |||
5th Order | |||
6th Order | |||
7th Order | |||
8th Order | |||
Other | Other unlisted orders. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Applications | The industrial field in which the device will be used. | ||
Your choices are... | |||
General | Filters are suitable for general-purpose applications. | ||
Audio/Video | Filters are designed for audio or video applications. | ||
Automotive | Filters are designed for automotive applications. | ||
Avionics | Filters are designed for avionics applications. | ||
Commercial | Filters are designed for commercial applications. | ||
Communications | Filters are designed for communications applications. | ||
Computers | Filters are designed for computers. | ||
Data Acquisition | Filters are designed for data acquisition applications. | ||
EMI Filtering | Filters are designed for electromagnetic immunity (EMI) or electromagnetic compliance (EMC) filtering systems. | ||
Industrial | Filters are designed for industrial applications. | ||
Medical | Filters are designed for medical equipment and medical applications. | ||
Military | Filters are designed for military applications. | ||
Portable Devices | Filters are designed for portable devices such as portable digital assistants (PDA), digital cameras, and cell phones. | ||
Ripple Attenuator | Filters are designed to trim or filter the ripple voltage produced at the output of AC-DC or DC-DC converters. | ||
Other | Other unlisted applications. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Filter Performance
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Differential Mode Attenuation | The attenuation of the filter is the ratio, at a given frequency, of the amplitude of the input signal to the filter to the output signal. It is measured in decibels (dB). Differential mode attenuation is the attenuation obtained when the filter is operating in differential mode. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Operating Temperature | Operating temperature is the value specified by a level (minTypMax) of the ambient temperature (in °C) in which this item was designed to operate. | ||
Search Logic: | User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria. | ||
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Cutoff or Center Frequency (Fc) | The filter type determines the specified frequency (Fc). For band pass and band reject filters, the specified frequency is the center frequency. For low pass filters, the specified frequency is the cut-off frequency. For high pass filters, the specified frequency is the cut-on frequency. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Bandwidth | Bandwidth is the range of frequencies that filters pass with minimal attenuation or, in the case of band reject filters, maximum attenuation. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Package Characteristics
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Package Type | |||
Your choices are... | |||
DIP | Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). | ||
CDIP | Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. | ||
PDIP | Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. | ||
DPAK | DPAK refers to a type of transistor outline package (T0-252). | ||
CSP | Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. | ||
SIP | SIP refers to a single inline package. | ||
SOIC | SOIC refers to a small outline IC. | ||
SSOP | SSOP refers to a shrink small outline package. | ||
SOP | SOP is a small outline package. | ||
MSOP | Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. | ||
SOT | SOT packaging refers to a small outline transistor. | ||
SOT23 | SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. | ||
PSOP | PSOP refers to a power small outline package. | ||
QFP | QFP is a quad flat package. | ||
TO-220 | Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. | ||
TO-3 | Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. | ||
SC-70 | SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. | ||
TSSOP | TSSOP refers to thin shrink small outline L-leaded packages. | ||
QSOP | QSOP refers to a quarter size outline package. | ||
PLCC | PLCC refers to a plastic leaded carrier. | ||
UCSP | UCSP refers to an ultra chip scale package. | ||
Other | Other unlisted, specialized or proprietary packages. | ||
Search Logic: | Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Pin Count | Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Number of Devices in Package | This refers to the number of devices in the package. | ||
Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Standards and Certifications
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RoHS Compliant | Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. | ||
ELV Directive | End of Life Vehicles (ELV) Directive required that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum; and in solderable applications. | ||
Other | Other unlisted, specialized, or proprietary standard or certifications. | ||
Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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