Operational Transconductance Amplifiers (OTA) Specifications

Help with Operational Transconductance Amplifiers (OTA) specifications:

Performance

	Forward Transconductance (gm)
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	Input Bias Current (IBIAS)		Input bias current (IBIAS) is the average of the two op-amp input currents.
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	Supply Voltage (VS)		Supply voltage (VS) refers to the source voltage range.
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	Supply Current (IS)		Source current (IS) is the current produced by the supply source when connected to the amplifier.
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	Output Current (Iout)		Output current (Iout) is the maximum continuous current that can be delivered in the output of the amplifier.
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	Input Offset Voltage (VOS)		Input offset voltage (VOS) is the differential DC voltage required at the op-amp's two inputs in order force the output voltage to zero. This occurs when no load is connected to the amplifier.
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	Output Voltage Swing (VOM)		Output voltage swing (VOM) is the range of the output voltage.
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	Input Impedance (Zi)		Input impedance (Zi) is the total resistance between the amplifier's two input terminals.
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	Slew Rate (SR)		Slew rate (SR) is the rate of change of the output voltage in response to a step input.
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	Bandwidth		An amplifier's power bandwidth or large-signal bandwidth refers to the device's ability to provide a maximum output voltage swing with increasing frequency. At certain frequencies, the output becomes slew-rate limited and begins to degrade. This frequency is the upper limit of the power bandwidth. The output voltage at this frequency is the peak output swing of the amplifier.
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	CMRR		Common mode rejection ratio (CMRR) measures an amplifier's ability to reject input voltages that are common to both of its input terminals. CMRR is defined as the ratio of the differential gain to the common gain. Typically, this value is measured in decibels.
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	Total Harmonic Distortion (THD)		Total harmonic distortion (THD) is a measure of the purity of a signal. It is defined as the ratio of the sum of the powers of harmonic components to the power of the fundamental.
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	Operating Temperature		Operating temperature is specified by level (minTypMax) of the ambient temperature (in °C) in which the amplifier was designed to operate
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	Operating Range / Applications		The industrial field in which the device will be used.
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	Automotive		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for automotive applications.
	Commercial		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications.
	Industrial		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications.
	Medical		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for medical applications.
	Military		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications.
	Other		Other unlisted operating ranges.
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Package Characteristics

	Package Type
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	DIP		Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications.
	DPAK		DPAK refers to a type of transistor outline package (T0-252).
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	SIP		SIP refers to a single inline package.
	SOIC		SOIC refers to a small outline IC.
	SSOP		SSOP refers to a shrink small outline package.
	SOP		SOP is a small outline package.
	MSOP		Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping.
	SOT		SOT packaging refers to a small outline transistor.
	SOT23		SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
	PSOP		PSOP refers to a power small outline package.
	QFP		QFP is a quad flat package.
	TO-220		Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220.
	TO-3		Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3.
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
	TSSOP		TSSOP refers to thin shrink small outline L-leaded packages.
	QSOP		QSOP refers to a quarter size outline package.
	PLCC		PLCC refers to a plastic leaded carrier.
	UCSP		UCSP refers to an ultra chip scale package.
	Other		This refers to other unlisted, specialized, or proprietary packages.
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	Pin Count		Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Number of Devices in Package		This refers to the number of devices in the package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

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Features

	Bidirectional Current Sense		Bidirectional current sense amplifiers can conduct current in both directions.
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	Current Limiter		The amplifier has an embedded current limiter.
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	Complementary Outputs		The device has at least two outputs that are complementary.
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	Integrated Reference		The comparator has its own embedded reference voltage.
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	On-Chip ESD Protection		The chip has embedded radiation protection.
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	Rail-to-Rail Output		The rail-to-rail output voltage swing is measured from the negative to the positive value of the supply voltage.
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	Rail-to-Rail Input		The rail-to-rail input voltage can vary from the negative to the positive value of the supply voltage.
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	Single Supply		The chip can operate with only one supply.
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	Thermal Shutdown Protection		The regulator has an embedded control circuit that shuts down the device when the temperature exceeds a predefined limit.
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Standards and Certifications

	RoHS Compliant		Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl, and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
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	ELV Directive		The End of Life Vehicles (ELV) directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of July 1, 2003. Lead can still be used as an alloying additive in copper, steel, aluminum, and in solderable applications.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

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