Memory Chips Specifications

The Engineering360 product database has 60,016 results in Memory Chips.

The most-popularly used boolean specification for Memory Chips is Memory Category.
The three most-popular values for that specification are:

EEPROM: 17,105 products from 20 suppliers
Flash: 16,552 products from 16 suppliers
SRAM: 15,527 products from 17 suppliers

The most-popularly used range spec for Memory Chips is Density.
This spec's lowest value in the database is 8.00 kbits. That value belongs to part number 31C5318 from Newark, An Avnet Company
This spec's highest value in the database is 1024000000000.00 kbits. That value belongs to part number NAND Flash Memory from SK Hynix

Please use the form below to filter the Memory Chips database to find a product which suits your needs.

Help with Memory Chips specifications:

Memory Type


	Memory Category
	Your choices are...
	DRAM		Dynamic RAM (DRAM) stores each bit of data in a separate capacitor. DRAM derives its name from the fact that it must be refreshed periodically. Because of the way in which the memory cells are constructed, the reading action refreshes the contents of the memory. DRAM loses its data when the power supply is removed.
	SRAM		Static RAM (SRAM) is more expensive than DRAM, but faster and more reliable. Unlike DRAM, SRAM does not need to be refreshed constantly; SRAM is refreshed only when a write command is performed. SRAM is most commonly used in the L2 cache for PCs. There are two types of SRAM: synchronous and asynchronous. Synchronous RAM is synchronized with the system clock. Asynchronous RAM is not.
	FIFO		First in, first out (FIFO) memory is used in buffering applications between devices that operate at different speeds or in applications where data must be temporarily stored for further processing.
	Flash		Flash is a form of electrically erasable, programmable, read-only memory (EEPROM) that can be erased and reprogrammed in blocks instead of one byte at a time. Flash memory is non-volatile, which means that it does not need a constant power supply in order to retain data. Flash offers extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. Flash memory chips have a lifespan of approximately 100,000 write cycles - a fact that makes Flash unsuitable for use as computer main memory. Typically, Flash memory chips are used in portable or compact devices such as digital cameras, cell phones, pagers, and scanners. Flash memory chips are also used as solid-state disks in laptops and as memory cards for video game consoles.
	PROM		Programmable ROM (PROM) can be written to only once, after which the contents are unchangeable.
	EPROM		Erasable programmable read-only memory (EPROM) is a type of PROM that can be erased through exposure to ultraviolet light and then reprogrammed.
	EEPROM		Electrically erasable programmable read-only memory (EEPROM) is a type of PROM that can be erased electrically and then reprogrammed.
	LILO		LILO memory chips use last in, last out (LILO) memory, a storage method in which data that is stored last is retrieved last.
	MASK ROM		MASK ROM is a type of read-only memory (ROM) that can be programmed only once. Manufacturers that produce high volumes of semiconductors often use MASK ROM because it is the most cost-effective ROM available.
	NVRAM		Non-volatile RAM (NVRAM) is a type of RAM that retains data when power is removed.
	MRAM		Magnetoresistive random access memory (MRAM) stores bits of data by using magnetic charges. MRAM is designed for high density, high speed, and non-volatile devices and has the potential to replace DRAM and Flash (EEPROM) memory.
	FRAM		Ramtron’s ferroelectrics random access memory (FRAM) is a new generation of nonvolatile memory that combines high-performance and low-power operation with the ability to retain data without power. FRAM has the fast read/write speed and low power of battery-backed SRAM and eliminates the need for a battery. EEPROM and Flash require long write times, wear out after being written a small number of times, and use a large amount of power to write data. FRAM writes instantly, has virtually unlimited endurance, and requires very little write power.
	NVSRAM		Non-volatile static random access memory (nvSRAM).
	Other		Other unlisted memory types.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

Organization


	Density		The capacity of the memory chip expressed in bits.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Number of Words		The number of "rows" in the organization of the memory chip. Each row stores a memory word and connects to a word line (one line of the memory bus) for addressing purposes.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Bits per Word		The number of "columns" in the organization of the memory chip. Each column connects to a sense / write circuit (a bit), which connects to data input/output lines of the chip.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

Packaging Information


	IC Package Type
	Your choices are...
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	TQFP		Thin quad flat package (TQFP).
	SOP		Small outline package (SOP).
	SOIC		Small outline integrated circuit (SOIC).
	TSOP		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	SSOP		Shrink small outline package (SSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	SIP		Single in-line package (SIP).
	Other		Other unlisted, specialized, or proprietary IC packages.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

Logic Family


	Logic Family
	Your choices are...
	CMOS 4000		CMOS 4000 refers to the 4000 series that is true CMOS with non-TTL levels.
	Emitter Coupled Logic (ECL)		Emitter coupled logic (ECL) uses transistors to steer current through gates that compute logical functions. By comparison, TTL and related families use transistors as digital switches, where the transistors are either cut off or saturated, depending on the state of the circuit. This distinction explains ECL's chief advantage: that because the transistors are always in the active region, they can change state very rapidly, so ECL circuits can operate at very high speed; and also its major disadvantage: the transistors are continually drawing current, which means the circuits require high power, and thus generate large amounts of waste heat. ECL gates use differential amplifier configurations at the input stage. A bias configuration supplies a constant voltage at the midrange of the low and high logic levels to the differential amplifier, so that the appropriate logical function of the input voltages will control the amplifier and the base of the output transistor. The propagation time for this arrangement can be less than a nanosecond. Other noteworthy characteristics of the ECL family include the fact that the large current requirement is approximately constant, and do not depend significantly on the state of the circuit. This means that ECL circuits generate relatively little power noise, unlike many other logic types that typically draw far more current when switching than quiescent, for which power noise can become problematic. ECL circuits operate with negative power supplies, and logic levels incompatible with other families, which mean that interoperation between ECL and other designs, are difficult. The fact that the high and low logic levels are relatively close mean that ECL suffers from small noise margins, which can be troublesome in some circumstances.
	Transistor-Transistor Logic (TTL)		Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable, as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL signals are defined as "low" or L when between 0 V and 0.8 V with respect to the ground terminal, and "high" or H when between 2 V and 5 V. The first logic devices designed from bipolar transistors were referred to as standard TTL. The addition of Schottky diodes to the base collector of bipolar transistor was called Schottky logic (S-TTL). Schottky diodes shorten propagation delays within TTL by preventing the collector from going into what is called “deep saturation.” Other TTL technologies include low-power Schottky (LS-TTL), advanced Schottky (AS-TTL), advanced low-power Schottky (ALS-TTL), and low-voltage TTL (LVTTL).
	LCX		Low voltage CMOS (LCX) operates with 3 V or 5 V.
	LV		Standard low voltage CMOS (LV).
	L		Low Power (L)
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

Power Characteristics


	Supply Voltage:
	Your choices are...
	-5 V		The chip operates with -5 volts.
	-4.5 V		The chip operates with -4.5 volts.
	-3.3 V		The chip operates with -3.3 volts.
	-3 V		The chip operates with -3 volts.
	1.2 V		The chip operates with 1.2 volts.
	1.5 V		The chip operates with 1.5 volts.
	1.8 V		The chip operates with 1.8 volts.
	2.5 V		The chip operates with 2.5 volts.
	2.7 V		The chip operates with 2.7 volts.
	3 V		The chip operates with 3 volts.
	3.3 V		The chip operates with 3.3 volts.
	3.6 V		The chip operates with 3.6 volts.
	5 V		The chip operates with 5 volts.
	Other		Other unlisted supply voltages.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Operating Current		The minimum current needed for active chip operation.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Standby Current		The minimum current needed for the operation of the chip while it is inactive.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Power Dissipation		Power dissipation is the total power consumption of the device. It is generally expressed in watts or milliwatts.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

More Specifications


	Bandwidth		The capacity to move data on an electronic line such as a bus or a channel. In short, the amount of data moved relative to a specific time frame. It is expressed in bits, bytes, or hertz (cycles) per second.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Data Rate		The transfer speed in hertz. This is the number of bits per second that can be moved internally in the chip.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Access Time		A measurement of time in nanoseconds (ns) used to indicate the speed of memory. Access time is a cycle that begins the moment the CPU sends a request to memory and ends the moment the CPU receives the data it requested. Specifically, for a synchronous device it is the time, usually in ns, from a clock edge to when data is available at the output of a device. For an asynchronous device it is the time from the initiation of the read cycle to when the data output is available.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Cycle Time		Interval of time required to perform a single read or write operation and reset the internal circuitry so another operation can begin. Cycle time defines how much time is required between clock edges in a synchronous device.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Data Retention		The time (in years) that the memory chips can retain the data without reloading.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Endurance		The maximum number of write / read cycles that the chip can support.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Operating Temperature:		This is the full-required range of ambient operating temperature.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

Memory Chips Specifications

Memory Category:

Density:

Number of Words:

Bits per Word:

IC Package Type:

Logic Family:

Supply Voltage:

Operating Current:

Standby Current:

Power Dissipation:

Bandwidth:

Data Rate:

Access Time:

Cycle Time:

Data Retention:

Endurance:

Operating Temperature:

Help with Memory Chips specifications: