RF Power Detector ICs Specifications

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Device Performance


	Frequency Range		The frequency range that devices can measure.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	dBm Measurement Range		The maximum dBm power that devices can measure. dBm = 10 log (P/Pref), where P is the measured power and Pref is the reference power (1 milliwatt).
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Bandwidth		Bandwidth is the range of operating frequencies of the device
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Input Voltage Range (V_cc)		The needed input voltage (range) needed to operate the device.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

Packaging


	IC Package Type:
	Your choices are...
	Bare Die		Devices are sold in semiconductor die form. They do not have a case or packaging.
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	FCBGA		Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints.
	PBGA		Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
	MCM-PBGA		Multi-chip module plastic ball-grid array (MCM-PBGA).
	SBGA		Super ball-grid array (SBGA) provides a high power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance).
	TBGA		Tape ball-grid array (TBGA).
	CPGA		Ceramic pin-grid array (CPGA).
	PPGA		Plastic pin-grid array (PPGA).
	FCPGA		Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown without any wire bonding.
	IPGA		Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA.
	PGA		Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second-level packaging efficiency and encapsulated for second-level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	FCCSP		Flip-chip chip-scale package (FCCSP).
	SuperFC®		Super flip-chip or SuperFC® packages feature a controlled bond line die attached directly to a copper heat spreader. SuperFC® is a registered trademark of Amkor.
	UCSP		Ultra chip scale package (UCSP).
	WLCSP		Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction.
	LGA		Tape ball-grid array (TBGA) uses a fine polyimide substrate and provides good thermal performance with high pin counts.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	LQFP		Low quad flat package (LQFP).
	TQFP		Thin quad flat package (TQFP).
	PQFP		Plastic quad flat package (PQFP).
	QFN		Quad flat non-leaded package (QFN) is also known as QFNL.
	VQFP		Very thin quad flat package (VQFP).
	MSOP		Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar coded. Reels are placed inside barcode-labeled boxes for shipping.
	PSOP		Power small outline package (PSOP).
	SOP		Small outline package (SOP).
	QSOP		Quarter size outline package (QSOP).
	MLP		Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm.
	SOIC		Small outline integrated circuit (SOIC).
	TSOJ		Thin small outline J-leaded package (TSOJ).
	TSOP Type I, Type II		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing-shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	TSOP Type I		Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing-shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	TSOP Type II		Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing-shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	SSOP		Shrink small outline package (SSOP).
	VSSOP		Very thin shrink small outline package (VSSOP).
	TVSOP		Thin very small outline package (TVSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	HSOP		Small Outline with heat sink package.
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry, pressed, ceramic surrounding a "DIP formed" lead frame. The ceramic/LF/ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers, commercial electronics and telecommunications.
	SIP		Single in-line package (SIP) is a semiconductor package which has only one row of pins.
	SDIP		Shrink dual in-line package (SDIP).
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited.
	SZIP		Shrink zigzag in-line package (SZIP).
	TDFN		Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages.
	SOT23		SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
	Other		Other unlisted, specialized, or proprietary IC packages.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Pin Count		The number of pins in the package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

Standards, Options and Features


	Measurement Options
	Your choices are...
	RMS		Devices provide true RMS measurements. RMS is an acronym for root mean square (RMS, a statistical measure of time-varying value.
	Peak		The device measures the peak RF value.
	Spread Spectrum		The device is capable of measuring the power level of a spread spectrum signal.
	Logarithmic		The device output is logarithmic.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Output Interface
	Your choices are...
	Analog Voltage		The device output is an analog voltage signal proportional to the measured signal.
	Analog Current		The device output is an analog current signal proportional to the measured signal such as 4-20ma
	TTL		The device outputs a digital transistor-transistor logic signal.
	Serial		Serial port or asynchronous serial interfaces are system-to-system communication interfaces in which data is sent over a single wire (serial). Serial communications include RS232, RS422, and RS485, etc.
	BCD		Binary coded decimal (BCD) is a circuit code which represents decimal numbers in binary code. With BCD, each decimal digit is represented by the four-bit binary representation of the digit.
	Other		Other unlisted interfaces.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Standards and Certifications
	Your choices are...
	RoHS Compliant		Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
	WEEE Compliant		“The Waste Electrical and Electronics Equipment Regulations (WEEE Regulations) is a European Parliament Directive with the aim of encouraging reuse, recycling and recovery of electrical and electronic equipment, and to improve the environmental impact and performance of this equipment. This directive sets the requirements and criteria for the collection, treatment, recycling and recovery of this equipment. It makes producers responsible for financing these activities, and retailers and distributors must provide means for consumers to return used or obsolete equipment’s without charge.
	ELV Directive		End of Life Vehicles (ELV) Directive requires that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead as of 7/01/2003. Lead can still be used as an alloying additive in copper, steel and aluminum and in solderable applications.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Operating Temperature:		This is the ambient temperature range through which the device is designed to operate.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

RF Power Detector ICs Specifications

Frequency Range:

dBm Measurement Range:

Bandwidth:

Input Voltage Range (Vcc):

IC Package Type:

Pin Count:

Standards and Certifications:

Operating Temperature:

Help with RF Power Detector ICs specifications:

Input Voltage Range (V_cc):