Indium Corporation offers custom manufacturing for these products:
Filler Alloys and Consumables
Indium Corporation - manufactures custom filler alloys and consumables to match your specifications. Alloy systems liquid at room temperature have a high degree of thermal conductivity far superior to ordinary non-metallic liquids. This results in the use of these materials for specific heat conducting applications.
Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, & tin-silver solder bumps & copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, in San Francisco
From flat panel displays to cryogenic seals and thermal interfaces to stretchable electronics, Indium’s materials are literally all around us. Because of their unique properties with virtually limitless applications Indium’s liquid alloys are a valuable tool in engineers’ tool kits.
Solder preforms are manufactured shapes of solder or braze metals designed to fit a specific joint configuration. Preforms contain precise and predetermined quantities of an alloy or a pure metal. They have been used in a variety of applications, such as hybrid and discrete component assembly and surface mount technology.
Thermal Compounds and Thermal Interface Materials
custom thermal compounds and thermal interface materials to match your
Thin Film Materials
WHITE PAPER: Ensuring Pristine Microbumps in Dimensional Devices. Moore’s Law, the driving force of the semiconductor industry for the last 60 years, is beginning to slow. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices
Indium Corporation is also listed in these categories:
Lead, Tin, and Low Melting Alloys
Nonferrous Metals and Alloys
Specialty Nonferrous Metals and Alloys