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Announcements

Shiu Li Technology Co., Ltd has promoted these products / services:

Shiu Li Technology Co., Ltd - Silicone Free with Low Density Thermal Gap Filler

LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs, and minimize material usage. Commonly used in electronic products and automotive electronic devices. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Lightweight Thermal Conductive Putty

LiPOLY's lightweight thermal conductive putty is a low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs, and minimize material usage and energy consumption. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of 4.... (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Silicone Free Thermal Absorber Pad

LiPOLY NT series is a thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin. It has a thermal conductivity of 2.0-4.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Silicone Free Thermal Pads,17.0 W/m*K

LiPOLY's silicone free thermal pads are no low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. They are ideally suited for applications such as optical, automotive, and sensitive electronic components. (read more)