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Shiu Li Technology Co., Ltd has promoted these products / services:

Shiu Li Technology Co., Ltd - LiPOLY® Silicone Free Thermal Conductive Putty

LiPOLY N-putty series is silicone free thermally conductive material. It also can overcome overflow and drying problems. N-putty is a great alternative to thermal grease. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Silicone Free Thermal Absorber Pad

LiPOLY NT series is a thermally conductive absorber based upon soft magnetic materials dispersed in a non-silicone resin. It has a thermal conductivity of 2.0-4.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Silicone Free Thermal Pads,17.0 W/m*K

LiPOLY's silicone free thermal pads are no low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. They are ideally suited for applications such as optical, automotive, and sensitive electronic components. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Two-Part Thermal Conductive Gap Filler

LiPOLY® BS04 is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 3.6 W/m*K. It is ideally suited for dispensing using the dispensing robot or by syringe. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Thermal Conductive Putty with 13.0 w/m*k

LiPOLY DTT13 is a one-part dispensable material with thermal conductivity 13.0 W/m*K. DTT13 is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. It also can overcome overflow and drying problems to increase the thermal conductivity. (read more)

Shiu Li Technology Co., Ltd - High Thermal Conductive Tape AT920-s

Applications:

  • Automotive electronics
  • Telecommunications
  • LED light bar & LED lamp
  • Between any heat-generating
  • component and heat sink
  • 5G base station & infrastructure
  • EV electric vehicle
(read more)
Shiu Li Technology Co., Ltd - Thermal Conductive Putty S-putty5-s

Applications:

  • Between CPU and heat sink
  • Between a component and heat sink
  • High speed mass storage drives
  • Telecommunication hardware
  • Flat-panel displays
  • Set-top box
  • IP CAM
(read more)
Shiu Li Technology Co., Ltd - LiPOLY® Thermal Pad with Minimal Oil Bleed

LiPOLY's AS series features minimal oil bleed even under high compression, preventing contamination of electronic components from silicon oil leakage or accumulation of dust, ensuring product cleanliness and appearance. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® High Ductile Thermal Conductive Pad

LiPOLY S818 and S393 is a product with high ductile thermal conductivity. Your best choice for shock and tolerance absorbing. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Non-silicone gap filler material

Non-silicon thermal pad does not contain silicone oil, no siloxane content. When used, no polution no volatiles, no electrical contact failure or lens fog situation. (read more)

Shiu Li Technology Co., Ltd - SH-putty3 is a great alternative to thermal grease

SH-putty3 is a highly conformable gap filler, designed to replace gap pads and remove manufacturing tolerance. It’s ideally suited for mass production applications in which a dispensing robot is needed. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® The Highest Thermal Conductive Gap Filler

LiPOLY T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. (read more)

Shiu Li Technology Co., Ltd - LiPOLY Thermal Conductive Die Attach Adhesive

LiPOLY’s TIM14 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation. (read more)

Shiu Li Technology Co., Ltd - LiPOLY Thermal Conductive Die Attach Adhesive

LiPOLY’s TIM12 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation. (read more)

Shiu Li Technology Co., Ltd - LiPOLY Two-part liquid gap filler

LiPOLY DM series is two-part liquid gap filler for different heights of design gap with a fast-curing feature. Low Viscosity. Thermal Conductivity: 2.2 W/m.k~7.0 W/m.k. Available for dispensing machines. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® wireless and 5G absorber in RF modules

LiPOLY’s DTT series is specially designed for network communication signal transmission. It focuses on Dk and Df to reduce interference in RF modules. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Liquid Thermal Interface Materials

Thermal Putty vs Thermal Grease vs Two-Part Fast Curing Thermal Conductive Gel (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Thermal Conductive RF Absorber Pad

LiPOLY® TEM96 series is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermal conductivity of 2~4.0 W/m*K. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Thermal Conductive Liquid Gap Filler

LiPOLY® SH-putty3 is a one-part thermally conductive putty that offers outstanding thermal conductivity. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Thermally Conductive Putty

LiPOLY® has created a new advanced thermal interface material. H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Ultra-High Performance Thermal Gap Filler

LiPOLY® PK700DM is a two-part, low viscosity with good thixotropic characteristics thermal conductivity gap filler. With a thermal conductivity of 7.0 W/m*K. PK700DM provides high thermal conductivity and low thermal impedance; ultra-conforming, a gel-like material after being cured for fragile and low-stress applications. Available in 50ml and 400ml cartridges. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Nano Thermal Interface Grease

TT3000 provides superior performance and reliability while mitigating against pump-out and floating issues on the interface. TT3000 improves the operating process while simultaneously providing high thermal conductivity and excellent low thermal resistance. This material will handle the most demanding of applications. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® is your thermal solution!

LiPOLY® T-work9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of
heat. (read more)

Shiu Li Technology Co., Ltd - Two-component thermally conductive adhesive

LiPOLY’s TIM14 is a two-part compound silicone base thermal conductive adhesive gel. The high deformation properties perfectly fill small air gaps to eliminate tolerances. It’s ideally suited for manual dispensing applicator and dispensing robot. Friendly design escape from high cost of cold-chain transportation and freeze preservation (read more)

Shiu Li Technology Co., Ltd - Two-part compound sealing glue

LiPOLY’s TPS series is a two-part compound sealing glue that can be cured at room temperature or high temperature. (read more)

Shiu Li Technology Co., Ltd - LiPOLY® Exceptionally Soft Thermal Conductive Pad

LiPOLY®’s BS series is an ultra-soft thermally conductive gel pad with high resilience characteristics which can avoid the deformation of PCB and other components caused by assembly stress. Hardness Shore OO/10-25 provide high flexibility, high compressibility, high insulation and good self-adhesiveness. (read more)

Shiu Li Technology Co., Ltd - Fast cured at RT,Two-Part Thermal Gap Filler

LiPOLY® PK700DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 7.0 W/m*K, PK700DM provides high thermal conductivity and
low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe. (read more)

Shiu Li Technology Co., Ltd -  Solvent-free, Nano-Thermal Interface Grease

Features

  • Thermal conductivity:6.0 W/m*K
  • Stable and homogeneous compound
    to ensure thermal performance
  • Solvent-free formula
  • Nano type thermal interface material
  • High stability and reliability
(read more)
Shiu Li Technology Co., Ltd - S-putty5-s, a great alternative to thermal grease

Applications

  • Notebook computers
  • Heat pipe assemblies
  • TV hardware
  • Wireless communication hardware
  • High-speed mass storage drives
  • Set-top box
  • IP CAM
(read more)
Shiu Li Technology Co., Ltd - Thermal Solutions for Electronic Vehicles

Our customers come to us because we deliver innovative and reliable thermal interface solutions. (read more)

Shiu Li Technology Co., Ltd - Innovative Thermal Solutions for 5G

Our customers come to us because we deliver innovative and reliable thermal interface solutions. (read more)

Shiu Li Technology Co., Ltd - Insulated Thermal Conductive Tape

Customized die-cut and shape molding are all available which can meet the special needs of customers in the face of today’s advanced products. (read more)

Shiu Li Technology Co., Ltd - UL Flammability Thermal Conductive Tape

LiPOLY’s ST series is a thermally conductive tape with high insulation and high temperature resistance, the temperature can reach to 288°C in a short time. (read more)

Shiu Li Technology Co., Ltd - Complex Thermal Conductive Material

LiPOLY’s G series have EMI shielding effect, they can be bent and are suitable for thin and high-performance mobile devices, especially the XY axis has excellent thermal conductivity. The heat transfer method is through uniform temperature to assists heat element for heat diffusion. (read more)

Shiu Li Technology Co., Ltd - Silicone & Non-Silicone Thermal Putty

Thermal Putty is a gap filler material with high deformation amount, low thermal resistance, flexible gap adaptation, and excellent tolerance compensation. No overflow & dryness & cracking problems. Good alternative to thermal grease. (read more)

Shiu Li Technology Co., Ltd - Benefits of choosing LiPOLY gap filler

While silicone-based TIMs do have potential disadvantages to consider with specific applications, there are other aspects to consider when selecting a TIM. Generally, the silicone-free TIM should have a good thermal conductivity, high-temperature stability and low thickness after clamping. (read more)

Shiu Li Technology Co., Ltd - 5G mmWave Thermal Conductive Gel Pad

LiPOLY DTT series is a soft thermally conductive gel pad specifically designed for networking communication applications, including 5G infrastructure/station, communication satellite…etc. It is designed to focus on Dk and Df to reduce interference in RF modules. Thermal conductivity 3~4W/m*K. (read more)

Shiu Li Technology Co., Ltd - Thermal Gap Pad with Fiberglass Reinforced

LiPOLY S282 series is the thermal conductive pad using fiberglass as a reinforced layer, featuring high dielectric breakdown, shock and vibration absorber, good mechanical strength. It is ideally suited for stamping and screw-locking. Thermal conductivity 2.5 W/m*K. (read more)

Shiu Li Technology Co., Ltd - Liquid fluid thermally conductive sealing glue

Two-part, thermal-conductive sealing glue
LiPOLY's TPS series is a two-part sealing glue with low viscosity and high fluidity. The high-deformation material can fill the gap closely, cover the tolerance and has outstanding conductivity at 2.8 W/m*K. (read more)

Shiu Li Technology Co., Ltd - Two-Part Thermal Conductive Sealing Glue

LiPOLY’s EP series is silicon-free two-part compound that can be cured at room temperature or high temperature. (read more)

Shiu Li Technology Co., Ltd - What is Low-molecular-weight siloxane?

The chemical formula indicates that the non-reactive cyclic polydimethylsiloxane Ho-[Si(CH3)2O]nH is volatile and volatilizes at any time. For example, when electronic products are in a closed space, the low volatile siloxane will cause obstacles to electrical contacts. (read more)

Shiu Li Technology Co., Ltd - Non-Silicone Environmental Material

Non-silicon thermal pad does not contain silicone oil, no siloxane content. When used, no polution no volatiles, no electrical contact failure or lens fog situation. (read more)

Shiu Li Technology Co., Ltd - Thermal highly Insulating Pad/Film

Excellent Insulation, Reworkable, Fiberglass reinforced layer is available (read more)

Shiu Li Technology Co., Ltd - Thermal Putty

One part dispensible thermal Putty, High Insulation, Low thermal resistance, high thermal conductivity, Bond Line Thickness from 100~3000um. (read more)