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Olympus provides an industry-leading portfolio of innovative test, measurement, and imaging instruments. Technologies include remote visual inspection, ultrasound, phased array, eddy current array, x-ray fluorescence, industrial microscopy, and optical metrology. Our products include ultrasonic flaw detectors and thickness gages, videoscopes, borescopes, microscopes, XRF analyzers, advanced nondestructive testing systems, and a large selection of industrial scanners, probes, software programs, and instrument accessories. For more information, contact us or give us a call at 281-922-9300.

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NDT Products
Olympus has an extensive portfolio of ultrasonic and eddy current flaw detectors with advanced features for applications ranging from weld inspection to detecting hidden cracks, voids, porosity, and other internal irregularities.


Remote Visual Inspection Products
Includes a wide range of videoscopes, borescopes, fiberscopes and turning tools for all your visual inspection needs


XRF/XRD Analyzers
 
Our X-ray Fluorescence (XRF) and X-ray Diffraction (XRD) Analyzers provide qualitative and quantitative material characterization for detection, identification, analysis, quality control, process control, regulatory compliance, and screening.



Microscope Solutions
Includes digital, laser confocal, stereo, upright, inverted, modular, and inspection microscopes in addition to analysis software, objective lenses and other accessories.




Product Catalog



Technical Articles

Detecting Damage on a Drill Bit Edge Using a Digital Microscope (Microscopy) Drill bits are widely used in industrial fields as a cutting tool. A drill bit is a thin spiral metal blade about 10 cm (3.9 in.) long. It is usually made of cemented carbide to resist wear and heat... (View Full Article)
Detecting Manufacturing Defects on Semiconductor Wafers Using a Digital Microscope (Semiconductors) Semiconductors are essential components in many electronic devices. Semiconductor manufacturing can be broken down into two processes-circuit formation and packaging. Circuit formation begins with... (View Full Article)