Technical Articles

Boyd Corporation has published these technical articles:

(Optical Components)
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Advanced optical films provide a number of screen enhancements in today's mobile electronics and display systems. Inclusive of directional light-control films, anti-glare films, device-protective...
(Heating and Cooling Equipment)
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Aavid Genie has a bonded fin heat sink as one of the options available to you in the Technology Matrix. For those unfamiliar to them, a bonded fin heat sink consists of 3 main parts: a base with...
(Heating and Cooling Equipment)
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Brazing is the process of melting a metal between two other pieces of metal in order to join them. Common metals for this process in the thermal management world include copper and copper based...
(Heating and Cooling Equipment)
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In thermal management, we describe our air cooled devices as using either natural convection or forced convection. Fans and blowers are the mechanisms behind forced convection cooling solutions, but...
(Calibration Instruments, Standards and Reference Sources)
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Finding how much heat your electronic device dissipates and how to calculate max case temperature can sometimes be a pain. The device you are using in your application will typically have an extensive...
(Automotive Equipment and Products)
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Anyone who has worked in the automotive industry is likely to be familiar with the acronym NVH which stands for Noise, Vibration & Harshness-a term referring to the general objective of designing cars...
(Electrical, Optical, and Specialty Materials)
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Optically Clear Adhesive (OCA) improves the brightness and contrast of a touch screen. It allows a clearer and more vivid user experience. With the level of integration today's mobile computing...
(Heating and Cooling Equipment)
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Thermals affect us everyday, even without us knowing. Heat transfer is just a form of energy transfer. We're busy people and move energy around all the time. When you start thinking thermally, you...
(Heating and Cooling Equipment)
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Extruded heat sinks are one of the most popular types of heat sinks. They're easy to make in bulk, economical, and have fewer secondary operations before a final product than other heat sink...
(Robotics)
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Folding has improved storage for air bags for vehicles or solar arrays for space applications. Origami has helped develop heart stents to self-expand into place making heart surgery a tad less...
(Heating and Cooling Equipment)
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There's lots of buzz on the internet about heat pipes and vapor chambers being amazing additions to air cooled heat sinks. But when it comes to heat pipes versus vapor chambers, what's the difference?...
(Temperature Sensing)
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How Do We Determine What Our Maximum Touch Temperature is?...
(Heating and Cooling Equipment)
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Many heat sink designs consist of separate fins and base and are assembled together using an adhesive process to bond the two together. These heat sink assemblies have an added thermal resistance in...
(Calibration Instruments, Standards and Reference Sources)
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Thermal management and heat transfer technology terms and definitions....
(Heating and Cooling Equipment)
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In a majority of thermal management solutions, we use thermal convection as a means to remove heat away from our sensitive components and devices. In the rare case we don't use convection, it's...
(Heating and Cooling Equipment)
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All too often, thermal management is considered too late, if at all, in the design process. In the effort to help make you the thermal expert in your office, the Aavid Genie team is always looking for...
(Heating and Cooling Equipment)
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In an earlier blog post, we discuss the importance of user product acceptance. We examined another gaming laptop product review that focused heavily on the thermal management solution and its...
(Heating and Cooling Equipment)
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Thermal interface material is crucial to every thermal management solution. It's also important to know the characteristics of various thermal interface material types so you're well equipped to make...
(Heating and Cooling Equipment)
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So, you've been tasked with the development of a new product. It's your first big project and you remember your thermodynamics from college, but your electrical engineers are telling you that your...
(Heating and Cooling Equipment)
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Thermal engineers are radiant about the effects of thermal radiation. Thermal radiation is one of three modes of heat transfer, along with convection and conduction, so the more we know about this...
(Heating and Cooling Equipment)
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TEGway ThermoReal is a thermoelectric device embedded controller. TEGway has developed a way to generate a flexible array of miniature thermoelectric devices (TEDs). This flexible array of TEDs is...
(Heating and Cooling Equipment)
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In the thermal management industry, we are highly concerned with the convection type. Is it natural or is it forced convection? The answer to that question makes a big difference when it comes to...
(Heating and Cooling Equipment)
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Defining Heat Sink Design Volume...
(Heating and Cooling Equipment)
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True to form, there have already been several engineers and techies filming tear downs of the Xbox One X. The team at TronicsFix posted a tear down video peeling away every layer of this high powered...
(Industrial Tapes)
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Modern display technologies face numerous design challenges. Current trends include the integration of high-end components and sensors, durability enhancements, edge-to-edge display technologies and...
(Automotive Equipment and Products)
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The development and production of electric and hybrid vehicles has been on the rise over the last 2 decades and this trend is likely to increase exponentially over the next 20 years. As automotive...
(Medical)
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Learn how HexArmor® and Boyd Corporation partnered together to quickly design and manufacture Personal Protective Equipment (PPE) like Face Shields and disposable goggles to protect healthcare...
(HVAC - Cooling)
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For help selecting a standard liquid cold plate...
(Heating and Cooling Equipment)
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3M and Boyd Corporation - Overheating is a critical concern for next-generation electronic assemblies. The combined effects of device miniaturization, high-powered processors, increased chip density,...