Printed Circuit Board Protection Methods -
Low Pressure Molding
Multicore DA100 is a flux designed for solder die attach paste applications.
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When used for cable and connector molding, it offers superior strain relief compared to conventional plastic injection molding. Benefits are: complete sealing of the components, providing water-tight encapsulation, effective strain relief, no hazardous fumes from materials or processing, short cycle time to complete part, environmentally friendly.
Henkel Electronics offers a look into some common questions and answers regarding Macromelt.
Learn the advantages of printed electronic circuitry, ink formulations, printing strategies, and industry applications.