A NEW COLOR! By combining the elements yttrium, indium and manganese a new BLUE pigment was created. It is vivid and bright and its most interesting feature may be that it reflects infrared light - so it deflects heat
InFORMS® are reinforced solder preforms with a unique composition that offers enhanced reliability. Learn more about how they prevent substrate tilt and create stronger joints.
InFORMS® help maintain the required bondline and promote good solder wetting. During the soldering process, the copper does not melt, ensuring that the bondline is maintained across the entire solder joint.
Are you having trouble getting consistently good stron solder joints? Improve first-pass yields - Reduce field failures - Improve performance - Enhance your company''s reputation for on-time delivery, high quality and reliable performance.
The trend toward product, and solder joint, miniaturization works directly against the creation of robust solder joints. Given the reduction of pad and component lead sizes, the reduction of stencil thicknesses (especially <0.3mm thick), and increasingly densely-packed components, are you even able to design and manufacture products with strong and dependable solder joints?
The answer is YES!
Why Care? Voiding Causes BIG Problems. Watch the video to learn how to address:
- Decreased yields
- Product field failures
- Customer dissatisfaction
See the full range of Indium's Void-Reducing Products
This is very valuable when attaching electrical contacts to ceramics - especially when heat input may damage the ceramic or its coating
Solder preform placement is tremendously faster using InTEGRATED(R) SOLDER PREFORMS from the Indium Corporation. Don't fumble with every single preform when you can place tens, or hundreds, in one simple motion
This video depicts the dissolution of a SAC (SnAgCu) solder sphere into molten Sn63 solder, at 208°C (below the melting temperature of the SAC alloy sphere).
The purpose of this research is to demonstrate that BGA assembly (using these materials) can be effected at temperatures BELOW standard Pb-free reflow temperatures (~245°C).
We are not suggesting that all BGA attachment be done at 208C. Rather we are demonstrating that going all the way up to 245C is not always required.
Learn more on this exact topic at Mario Scalzo's SMT blog:
INDIUM CORPORATION engineers are so dedicated to understanding the SMT process that they will do almost anything to gain more knowledge.
This ad was the B2B electronics assembly industry's first-ever video ad. It was released in December 2006.
NanoFoil® is an instantaneous heat source applicable to a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs
A preform is a piece of solder in a wide variety of shapes. Often, the preforms are coated with solder flux or have flux in the center of the metal. Preforms formed with a flux in the center like this are typically called flux-cored. However, preforms come in six solder families: gallium, bismuth, indium, tin, lead and gold-based. There are more than 200 different alloys that can be formed into preforms.