Palomar 6500 High Precision Component Placement Die Bonder: The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical applications.
Palomar Technologies' 3880 Die Bonder Component Placement Die Attach System: Palomar Technologies' 3880 Die Bonder component placement die attach system features a state of the art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest and most reliable multiple die-type bonder on the market.
Palomar Technologies 6532HP Die Bonder: Developed for the demanding needs for the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput.
Semiconductor Wire and Wedge Bonders
Palomar 9000 High-Speed Fine Wire Wedge and Ribbon Bonder: The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single machine.
8000i Wire Bonder - high-reliability wire bonder & ball (stud) bumper: The 8000i Wire Bonder is a fully automatic, thermosonic, high-speed gold bumper, ball and wire bonder, capable of improving production yields and eliminating sources of variation in your processes.
SST 5100 VACUUM PRESSURE FURNACE: The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. The system is designed for high production flux-less void-free soldering.
SST 8300 Series Automated Vacuum Pressure Soldering System: SST's new 8300 series automated vacuum pressure soldering system is ideal for the IGBT power module market. The series provides a highly reliable solder connection with a better than industry standard void rate.