Reliable protection of electronic components from mechanical impacts or environmental conditions is gaining increasing importance. Besides the protection from humidity, circuit boards and tracks for example need to be prevented from the effect of electromigration. This effect can lead to a short-circuit between closely lying tracks because of the migration of ions. In order to avoid these dangers circuit boards are coated using special resins. In a special way UV light curing dispensing materials are suitable for this so-called selective circuit board coating. These are materials, which are also often used in sealed connectors. For heat-sensitive components and in combination with the specially fitted Scheugenpflug dispensing line these materials achieve optimal handling characteristics and short cycle times through rapid curing.
The LeanCNCell is a production system designed to handle all metering and dispensing tasks for small and medium-sized batch production. Standard applications include applying or sealing of electronic assemblies and their housings with 1D, 2D or 3D contours. The dispensing material is supplied from cartridges or by means ofexternal supply units.
For smallest quantities in the nanolitre range, the dispensing system Dos Jet offers extremely high dispensing precision and speed. Opening and closing of the valves is controlled electropneumatically
With Scheugenpflug vacuum chambers bubble-free inline dispensing is possible with ultimate process reliability. A transport system delivers the workpiece pallets containing the workpieces to be processed, positions them and then moves them on. A multi-chamber system and the use of multiple dispensers allow extremely short cycle times. Moving the workpieces in, carrying out the dispensing process and moving them out again is distributed among several chambers. A 3-axis system accurately positions the workpieces, which guarantees a perfectly constant dispensing quality.
The Scheugenpflug Processing Module Comprising a Dispensing Unit, a Control Unit and a Multi-Axis System is the ultimate answer in metering and dispensing for systems integrators and automation providers, who seek to employ the highest processing technology standards in their production lines. Automation providers can integrate the dispensing module into new or existing production lines as easy as "plug-and play". The kinematical operation and placement of the axes is arranged to support the movements required in the production process. Usage: Potting, filling, applying of sealants, dam&fill applications; for sealing electronic housings, coiled products, sensor arrays, PCBs and so on. - Simple and Quick Integration - Without Complex Programming - Single Source Perfection
For automotive ECUs, precise and reliable sealing processes are particularly in demand in order to provide lasting protection to the electronics in the housings from damaging fluids and chemicals. In this case, sealing materials that also provide adhesion are used to bond the housing parts permanently to each other.
- The Dos GP gear pump dispensers, which were designed specifically for continuous bead application, are particularly suited for dispensing these materials.
- For potting sensors and ECUs, Scheugenpflug provides the ability to integrate additional production processes such as handling, joining and quality assurance. This gives us the ability to provide you with a custom, perfectly tailored production line with the downstream and upstream processes you require.
Advanced Driver Assistance Systems (ADAS) are changing the way vehicles drive. To identify the potential hazards and increase safety on the roads, dedicated data modules and sensors such as cameras, radar systems, ultrasonic sensors and LiDAR (Light Detection and Ranging) systems are being integrated into modern vehicles.
HENKEL BERGQUIST LIQUI FORM TLF4500CGEL-SF is a next generation thermal interface material. It is an easy-to-use, silicone-free 1-component solution with high thermal conductivity that can be used at high temperatures.
Scheugenpflug GmbH has already gained experience with this potting material and has put together a compact system solution for potting 1K thermal interface gels that is perfectly suited for this material:
A90 C - The compact material feeding system
DosP DP803 TCA - The volumetric piston dispenser DispensingCell DC803 - The high-performance multifunctional cell
Scheugenpflug is a leading provider of premium adhesive bonding, dispensing and potting solutions worldwide with exceptional automation expertise. Our product and technology portfolio ranges from powerful material preparation and feeding systems to advanced systems for atmospheric and vacuum potting, to modular inline and automated solutions tailored specifically to customer needs. Scheugenpflug dispensing systems are used in the automotive and electronics industries as well as in the telecommunication sector, medical technology and in the field of energy supply. Apart from our headquarters in Neustadt/Donau, we currently maintain four additional locations in China, the U.S., Mexico and Romania. The company also offers a global sales and service network, ranging from Spain to South Korea.
The Scheugenpflug ProcessModule allows systems integrators and automation providers to leverage the benefits of the strictest processing technology standards in their production lines or cells. The system can be quickly and safely integrated into new or existing production lines or cells as easy as "plug-and-produce". This ensures that all parameters and processes related to adhesive bonding and potting are accurately matched to each other, independently of the rest of the machine. The Scheugenpflug ProcessModule offers the optimal solution for a wide range of process requirements.
Thanks to powerful axis and motor technology, the ProcessModule offers high traversing speeds and thus short cycle times in matrix, bead and filling applications. It was developed for maximum economy and optimized for simple and flexible integration. The large traversing range enables the dispensing of adhesives and sealants as well as potting media on several parts in a single operation.
The automotive industry is facing one of the greatest challenges in its history: Emission-free, completely autonomous and also connected to the whole world - this is how the vehicle of the future will look like. And electronics is the main driving force behind innovation here. No matter if it is battery technology and e-drive, sensor technology, connectivity or artificial intelligence - without highly functional and compact electronic components, the path to tomorrow''s mobility would remain closed. Here, exact and repeatable adhesive bonding, sealing and potting processes as well as adequate materials provide reliable protection against harmful influences such as moisture, extreme temperatures or aggressive media.
Together with renowned, internationally active potting material manufacturers, we develop future-oriented dispensing solutions for you - precisely tailored to your application. Start with us into the automotive future!
Thermally conductive pastes protect against overheating and vibrations
Thermal influences have an enormous impact on the service life, capacity and above all the operational safety of Li-ion traction batteries. In order to prevent possible defects and damage caused by overheating, large quantities of heat-conducting potting materials are used.
There''s no denying it: Electronic components have to work. An optimal dispensing performance as well as an absolutely homogeneous and bubble-free material are the prerequisites for this. The new LiquiPrep LP804 system incorporates the process engineering know-how of 30 years of market activity and allows for reliable preparation and feeding of self-leveling adhesives and potting materials with a viscosity of up to 70,000 mPa∙s. Processes such as homogenization, tempering, circulation and evacuation can be used to specifically influence the processing properties of the medium. The heart of the system is a novel, intelligent diaphragm feed pump. State-of the-art sensors individually determine the degree of filling here. This ensures a continuously high feeding performance. The diaphragm feed pump also offers significantly increased wear resistance and thus a long service life.
The LiquiPrep LP804 is part of our new system solution.
Scheugenpflug has developed the new volumetric high performance dispenser Dos HP based on the proven piston dispenser. With this dispenser, dispensing rates of up to 80 ml/s (max. volume per shot: 370 ml) can be achieved - with consistently high dispensing accuracy. To ensure a sufficiently wide travel range for the media application, the Dos HP is mounted to a robot arm.
The PailFeed200 Abrasive barrel follower plate system for 200 liter drums is used to feed the potting material to the dispenser quickly and reliably. The output of the integrated double piston pump is 480 cm3/stroke, the possible delivery pressure reaches up to 65 bar.
For adhesive bonding, sealing and thermal management tasks with low media consumption, material is usually provided with commercial cartridges. Here, optimally tailored feeding systems are in demand which guarantee a gentle and constant material feed - even when processing small volumes. For these applications, Scheugenpflug has further developed its proven A90 C cartridge expulsion unit.
The A90 CV not only guarantees a reliable and failure-free feed of highly viscous media to the dispenser, but also features the new vacuum docking function. For the first time, this enables the automated ventilation during cartridge changes and thus an absolutely bubble-free docking process of the material cartridge to the dispensing system. So far, freshly mounted cartridges had been ventilated manually, meaning that the accompanying material loss was dependent on the routine and experience of the respective operator.
Compact and optimised for simple Gluing and Dispensing Tasks The DesktopCell unites all the advantages of a fully fledged dispensing cell and a small footprint. If there are more complex tasks to handle and the compact desktop system is still big enough for the job, it is possible to switch to a CNC-enabled Beckhoff control unit.
The system is designed as a powerful entry-level solution for vacuum dispensing that combines the advantages of a full-fledged vacuum dispensing system with an attractive price.
Application possibilities: • Dispensing of wound components (transformers, coils, etc.) • Suitable for filling, dot and grid dispensing • For self-levelling polyurethanes, silicones, epoxy resins, oils, etc.
High-power operation of assemblies and closely packed components require effective heat transfer to a heat sink in thermal contact with the circuit board (in the video represented as a glass body for better visibility). Inefficient heat transfer causes assemblies to overheat, which may damage the electrical components or result in failures in operation. The heat dissipated by the components is transferred from the assembly to the heat sink''s cooling surface, which is usually made of metal (aluminium), by so-called thermally conductive adhesives. These materials fill the voids present in the interface between the two objects caused by surface roughness or similar effects. However, their very high viscosity often poses greater challenges in the joining of two objects. The fast and patented method of vacuum bonding presents a joining process-reliable result in interaction with our volumetric piston dispensers.