BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to medical electronics. This product is curable at room temperature, however, the cure rate can also be accelerated with application of heat.

• Thermal conductivity: 3.5 W/m-K
• Low volatility for outgassing sensitive applications
• Ultra-conforming with excellent wet-out for low stress interfaces on applications
• 100% Solids – no cure by-products

BERGQUIST® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 10000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

• Thermal Conductivity: 10 W/m-K
• Ultra low modulus

BERGQUIST® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides resistance against puncture, shear and tear. It not only exhibits high thermal conductivity but also excellent thermal performance at low pressures. Therefore this product is ideal for high performance applications at low mounting pressures.

• High thermal conductivity: 5 W/m-K
• Highly conformable, "S-Class" softness
• Natural inherent tack reduces interfacial thermal resistance

BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Options and Configurations Sheet size - 8" x 8" Standard Thicknesses - 0,04, 0.06, 0.08, 0.1, 0.125 inch

• Thermal Conductivity: 7 W/m-K
• High-compliance, low compression stress
• Ultra low modulus

BERGQUIST® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. It is most effective for gaps as narrow as less than or equal to 3mm. BERGQUIST LIQUI FORM TLF 6000HG is pre-cured, requiring no mixing or refrigeration.

• Thermal Conductivity: 6.0 W/m-K
• Dispensable pre-cured gel
• Stable viscosity in storage and in the application
• Excellent chemical stability and mechanical stability

LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required.

• Thin, uniform bondline control
• Provides RF/EMI shielding
• Electrically conductive in x, y, z axes
• Excellent electrical and thermal conductivity

LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally associated with flexible films.

• High strength film with high thermal conductivity
• Thin bondline
• Uniform bondline control
• Good heat transfer

LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions.

• High adhesion strength at elevated
• High electrical conductivity
• High thermal conductivity
• Low cure temperature

LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. LOCTITE ABLESTIK CF 3366 passes NASA outgassing standards. This product can be cured at various temperatures. Please refer to the TDS for alternate cure schedules.

• High and stable adhesion at elevated temperatures – maintains adhesion strength up to temperatures as high as 175°C; extreme environment capable
• High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink
• Compatible with temperature-sensitive substrates and components – cures at a low temperature of 125°C
• Flexible – allows use of material combinations with CTE mismatches