• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• M.2 form factor 2280
• Powersafe
• PCIe Gen4 / NVMe 1.4 / four lanes
• High endurance 3D NAND TLC up to 1.92 TB
• Temperature range 0°C to 75°C
• High Performance
• AES256 Encryption / TCG Opal 2.0
• Crypto erase / IEEE 1667

The PCIe interface with NVMe protocol has become the new standard for consumer, enterprise and embedded applications. Although all three use the same SSD architecture, the individual requirements differ significantly. While high capacity and speed are most important for client and enterprise applications and are addressed by the market, the resulting heat generation poses a huge challenge to embedded applications.

The necessity to adopt the new interface standard while still just requiring small capacities ask for dedicates products. Immunity against data loss at power fail is a strong requirement for embedded and enterprise applications.

For industrial and embedded markets Swissbit addresses these different needs with the N-20m2/N2000 with HMB support, low power consumption and small form factors, and with the high performance N3002 and N-30m2 with powersafe™ hardware power fail protection. They feature thermal and data care management and various security options. Both series are also available in pSLC variants with highly increased endurance. The N3202 powersafe™ is optimized for NetCom and enterprise applications that require enterprise grade endurance with a strong Swissbit typical value set.

• M.2 form factor 2280
• Powersafe
• PCIe Gen4 / NVMe 1.4 / four lanes
• High endurance 3D NAND TLC up to 1.92 TB
• Temperature range 0°C to 75°C
• High Performance
• AES256 Encryption / TCG Opal 2.0
• Crypto erase / IEEE 1667

The PCIe interface with NVMe protocol has become the new standard for consumer, enterprise and embedded applications. Although all three use the same SSD architecture, the individual requirements differ significantly. While high capacity and speed are most important for client and enterprise applications and are addressed by the market, the resulting heat generation poses a huge challenge to embedded applications.

The necessity to adopt the new interface standard while still just requiring small capacities ask for dedicates products. Immunity against data loss at power fail is a strong requirement for embedded and enterprise applications.

For industrial and embedded markets Swissbit addresses these different needs with the N-20m2/N2000 with HMB support, low power consumption and small form factors, and with the high performance N3002 and N-30m2 with powersafe™ hardware power fail protection. They feature thermal and data care management and various security options. Both series are also available in pSLC variants with highly increased endurance. The N3202 powersafe™ is optimized for NetCom and enterprise applications that require enterprise grade endurance with a strong Swissbit typical value set.

• M.2 form factor 2280
• Powersafe
• PCIe Gen4 / NVMe 1.4 / four lanes
• High endurance 3D NAND TLC up to 1.92 TB
• Temperature range 0°C to 75°C
• High Performance
• AES256 Encryption / TCG Opal 2.0
• Crypto erase / IEEE 1667

The PCIe interface with NVMe protocol has become the new standard for consumer, enterprise and embedded applications. Although all three use the same SSD architecture, the individual requirements differ significantly. While high capacity and speed are most important for client and enterprise applications and are addressed by the market, the resulting heat generation poses a huge challenge to embedded applications.

The necessity to adopt the new interface standard while still just requiring small capacities ask for dedicates products. Immunity against data loss at power fail is a strong requirement for embedded and enterprise applications.

For industrial and embedded markets Swissbit addresses these different needs with the N-20m2/N2000 with HMB support, low power consumption and small form factors, and with the high performance N3002 and N-30m2 with powersafe™ hardware power fail protection. They feature thermal and data care management and various security options. Both series are also available in pSLC variants with highly increased endurance. The N3202 powersafe™ is optimized for NetCom and enterprise applications that require enterprise grade endurance with a strong Swissbit typical value set.

• M.2 form factor 2280
• Powersafe
• PCIe Gen4 / NVMe 1.4 / four lanes
• High endurance 3D NAND TLC up to 1.92 TB
• Temperature range 0°C to 75°C
• High Performance
• AES256 Encryption / TCG Opal 2.0
• Crypto erase / IEEE 1667

The PCIe interface with NVMe protocol has become the new standard for consumer, enterprise and embedded applications. Although all three use the same SSD architecture, the individual requirements differ significantly. While high capacity and speed are most important for client and enterprise applications and are addressed by the market, the resulting heat generation poses a huge challenge to embedded applications.

The necessity to adopt the new interface standard while still just requiring small capacities ask for dedicates products. Immunity against data loss at power fail is a strong requirement for embedded and enterprise applications.

For industrial and embedded markets Swissbit addresses these different needs with the N-20m2/N2000 with HMB support, low power consumption and small form factors, and with the high performance N3002 and N-30m2 with powersafe™ hardware power fail protection. They feature thermal and data care management and various security options. Both series are also available in pSLC variants with highly increased endurance. The N3202 powersafe™ is optimized for NetCom and enterprise applications that require enterprise grade endurance with a strong Swissbit typical value set.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
• Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
• User density 1.92TB, 3.84TB and 7.68TB
• Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
• Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
• High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
• Multi-namespace support up to 128
• Powersafe: power fail protection
• Security and encryption: TCG OPAL 2.01 / AES256

The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

• Datacenter SSD U.3 (15mm) PCIe Gen4x4, NVMe 1.4 interface
• Device densities 8TB and 16TB
• Sequential Read up to 6,900 MB/s, Random Read 4K up to 1,600k IOPS
• Sequential Write up to 7,000 MB/s, Random Write 4K up to 900k IOPS (16TB)
• Multi-namespace support up to 128
• High endurance 1.5 DWPD
• JEDEC enterprise workload over 5 years lifetime
• AES 256 Data Encryption & Crypto Erase
• powersafe power fail protection

The D1200 PCIe/NVMe SSD represents a significant leap forward in high-performance flash storage solutions. The Data Center SSD offers high reliability, ultimate performance, and low power consumption for I/O-intensive data center applications such as databases, data storage, cloud computing, and artificial intelligence. With an extended feature set that increases sequential and random write performance, peak efficiency of data center operations is ensured.

• Datacenter SSD U.3 (15mm) PCIe Gen4x4, NVMe 1.4 interface
• Device densities 8TB and 16TB
• Sequential Read up to 6,900 MB/s, Random Read 4K up to 1,600k IOPS
• Sequential Write up to 7,000 MB/s, Random Write 4K up to 900k IOPS (16TB)
• Multi-namespace support up to 128
• High endurance 1.5 DWPD
• JEDEC enterprise workload over 5 years lifetime
• AES 256 Data Encryption & Crypto Erase
• powersafe power fail protection

The D1200 PCIe/NVMe SSD represents a significant leap forward in high-performance flash storage solutions. The Data Center SSD offers high reliability, ultimate performance, and low power consumption for I/O-intensive data center applications such as databases, data storage, cloud computing, and artificial intelligence. With an extended feature set that increases sequential and random write performance, peak efficiency of data center operations is ensured.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• high density 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• PCIe M.2 1620 BGA
• PCIe Gen 3.1 / NVMe 1.3 4 lanes
• 291 Ball BGA, 0.8mm pitch 16 x 20mm
• 3D NAND TLC / pSLC
  
• Operational Temperature Range -40°C to 85°C
• Data Care Management
• Power fail protected
• AES 256 encryption

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

For high endurance demand the EN-26 with 3D NAND pSLC offers tenfold higher endurance compared to EN-20.

E2000 and E2600 are latest upgrades with new high density NAND Flash.

• Smallest removable SATA SSD form factor
• pSLC and MLC types
• DRAM-less low power consumption
• Hot plug support with full power fail data protection
• Full capacity
• Controlled BOM and PCN process

CFast™ cards combine the CompactFlash™ (CF) card form factor and the Serial ATA (SATA) interface into a single product. CFast™ cards can replace both HDDs and CompactFlash™ cards in applications requiring small form factors, high endurance and the ability to withstand shock, vibration, extreme temperatures (-40°C to +85°C), and rough environmental conditions. The Swissbit CFast™ card portfolio covers the range from high-end SLC-based high-performance F-600 to the cost/performance optimized 3D NAND F-86. The different product families are equipped with a rich feature set and are fulfilling the high Swissbit quality requirements.

• Smallest removable SATA SSD form factor
• pSLC and MLC types
• DRAM-less low power consumption
• Hot plug support with full power fail data protection
• Full capacity
• Controlled BOM and PCN process

CFast™ cards combine the CompactFlash™ (CF) card form factor and the Serial ATA (SATA) interface into a single product. CFast™ cards can replace both HDDs and CompactFlash™ cards in applications requiring small form factors, high endurance and the ability to withstand shock, vibration, extreme temperatures (-40°C to +85°C), and rough environmental conditions. The Swissbit CFast™ card portfolio covers the range from high-end SLC-based high-performance F-600 to the cost/performance optimized 3D NAND F-86. The different product families are equipped with a rich feature set and are fulfilling the high Swissbit quality requirements.