E-103 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Suitable for bonding metal, high temperature plastics, and ceramics where the maximum durability isdesired. Due to the aluminum filler the minimum bondline gap is approximately .002" to .003".

E-107 is a high performance silica filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Especially suitable for bonding magnets and other applications where dissimilar materials are bonded andmust withstand long term thermal cycling. Offers much higher hot bond strengh and long term durabilitythen modified acrylic adhesives. Has good adhesion to plastics as well as metal and ceramics.

E-108 is a high performance aluminum filled single component adhesive which provides exceptional shearstrength at elevated temperatures as well as good long term strength at high temperature. Due to thealuminum filler the minimum bondline gap is approximately .002" to .003".

E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic applications. Rapid cure speedmake it an excellent choice for automatic assembly using IR. induction, or hot air cure. Suitable for use withautomatic dispensing equipment.

E-110 is a high performance unfilled single component modified epoxy adhesive which can be cured at125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding bearings andmagnets and other applications where dissimilar materials are bonded and must withstand long term thermalcycling and the 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strengthand long term durability then modified acrylic adhesives or conventional epoxies. Has good adhesion toplastics as well as metal and ceramics. Because it is unfilled it does does create a bondline gap which wouldlead to reduced magnetic circuit efficiency or dimensional variation.

E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications for bonding magnets andother applications where dissimilar materials are bonded and must withstand long term thermal cycling andthe 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strength and longterm durability then modified acrylic adhesives or conventional epoxies. Has good adhesion to plastics aswell as metal and ceramics. Due to the aluminum filler the minimum bondline gap is approximately .002"to .003".

E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistance. Especially suitable for assembley applications such as building precisionelectric motors or otherelectromechanical devices. Offers much higher hot bond strength and long term durability then modifiedacrylic adhesives or conventional epoxies. Has good adhesion to plastics as well as metal and ceramics, notrecomended for copper alloys.