Product Description: According to the demands of customers,printing the circuit on the Al₂O₃/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness is formed.(HTCC)Features1. Corrosion resistance, high temperature resistance, long service life, uniform temperature, and good thermal conductivity2. Compared with LTCC, it has the advantages of high structural strength, high thermal conductivity, good chemical stability and high wiring density3. High electrical strength, high dielectric properties, low high-frequency lossApplication area: 1. Infrared sensors, high-frequency high-power circuits, large-scale integrated circuits, RF devices, image sensors 2. Power devices, optical communication, lasers, microwave devices.