Product Description: A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages.
Product Overview
STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates.
Non-conductive and Electrically Insulating
Ensures no electrical interference in sensitive electronic components.
Superior Adhesion
Developed for excellent adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates.
Thermosetting
Cures upon heating, providing a strong and durable bond.