Conductive die attach pastes offer excellent performance to meet today's high reliability standards.

Product Overview

ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.

A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages.

Product Overview

STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates.

Non-conductive and Electrically Insulating

Ensures no electrical interference in sensitive electronic components.

Superior Adhesion

Developed for excellent adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates.

Thermosetting

Cures upon heating, providing a strong and durable bond.

Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability.

Product Overview

STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or multi-chip modules (MCMs), its unique reworkable thermoplastic adhesive system provides key advantages in applications where traditional thermoset adhesives fall short.

A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi).

Product Overview

STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000 psi.

Its high compliance enables reliable bonding between materials with significantly different thermal expansion coefficients (TCEs). The adhesive’s reworkable thermoplastic system provides key advantages in applications where traditional thermoset adhesives are less effective.

Thermoplastic adhesive film excels in electronics, offering strong bonding for MCMs and better reworkability than thermosets.

Product Overview

STAYSTIK 482 Thermoplastic Adhesive Film is designed for a range of electronic applications and delivers excellent bonding performance. Suitable for die and/or substrate attach in hybrid or multi-chip modules (MCMs), its reworkable thermoplastic system offers key advantages in applications traditionally unsuited to thermoset adhesives.

Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked.

Product Overview

STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus of 60,000 psi. Its high compliance allows for reliable bonding between materials with significantly different thermal expansion coefficients (CTEs). The adhesive’s reworkable nature offers distinct advantages in applications where thermoset systems are typically less effective.

Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets.

Product Overview

STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or multi-chip modules (MCMs). Its reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.

Aluminum nitride-filled film resists high temps, ideal for die attach in hermetic packages, with low RGA and reworkability.

Product Overview

STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring resistance to high-temperature excursions. It is suitable for die attach in solder-sealed, hermetic packages and delivers low RGA moisture readings. This high-temperature, reworkable thermoplastic system offers unique advantages in applications where thermoset adhesives are typically less effective.

Aluminum nitride-filled adhesive film for electronics bonds well at low temps, handles different TCEs, and is reworkable.

Product Overview

STAYSTIK 672 Thermoplastic Adhesive Film is designed for a range of electronic applications, offering excellent bonding at low process temperatures and a very low elastic modulus of 60,000 psi. Its high compliance allows for effective bonding between materials with significant differences in thermal expansion coefficients (TCEs). STAYSTIK 672 is excellent for daughter card-to-board or heat sink attachment. Its unique reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.