DESCRIPTION:

G6E-NS10™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10™ has been developed based on advanced proprietary technology that requires 25% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS10™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is strongly recommended for curing. Uses for G6E-NS10™ epoxy include electronic circuits, EMI / RFI shielding assembly and repair, etc.

FEATURES:

· Silver-Carbon Filled (Non-Magnetic)

· Good Electrical Conductivity

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

TYPICAL APPLICATIONS:

· PCB Manufacture / Repair

· EMI / RFI Shielding

· Display Packaging / Bonding

· Electronics Manufacture / Repair

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic dark grey paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 4 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 60 hours @ 25°C / 77°F

3 hours @ 70°C / 158°F

1 hour @ 150°C / 302°F

DENSITY: Part A 2.0 – 2.15 g/cm3

Part B 2.0 – 2.15 g/cm3

MIXED VISCOSITY: 150 to 155 Pa·s @ 25°C / 77°F

GLASS TRANSITION TEMPERATURE (Tg): 103°C / 217°F cured at 150°C / 302°F

HARDNESS, SHORE: >60 D

VOLUME RESISTIVITY: 0.005 Ω·cm

DESCRIPTION:

Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS11™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. G6E-NS11™ epoxy is developed for general purpose applications requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing.

FEATURES:

· Silver-Carbon Filled (Non-Magnetic)

· Very Good Electrical Conductivity

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

TYPICAL APPLICATIONS:

· PCB Manufacture / Repair

· EMI / RFI Shielding

· Display Packaging / Bonding

· Electronics Manufacture / Repair

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic dark grey paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 4 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

60 hours @ 25°C / 77°F

3 hours @ 70°C / 158°F

1 hour @ 150°C / 302°F

DENSITY: Part A 2.15-2.30 g/cm3

Part B 2.30-2.40 g/cm3

MIXED VISCOSITY: 80 to 85 Pa·s @ 25°C / 77°F

GLASS TRANSITION

TEMPERATURE (Tg): 65°C / 149°F cured at 150°C / 302°F

HARDNESS, SHORE: >65 D

VOLUME RESISTIVITY: 0.0007 Ω·cm

DESCRIPTION:

G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or materials. G6E-FRP™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver).

A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible circuits, medical sensor assembly and repair and many other similar applications.

FEATURES:

· Flexible (after curing)

· Carbon Filled (Non-Metallic & Non-Magnetic)

· Electrically Conductive

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

TYPICAL APPLICATIONS:

· Wearable Electronics

· Medical Sensors

· Fiber-Optics Packaging

· Flexible Photovoltaic (Solar) Cell Packaging

· Surface Acoustic Wave (SAW) Devices

SPECIFICATIONS:

TWO COMPONENT SYSTEM: Part A – smooth black paste

Part B – smooth black paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 2 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

24 hours @ 25°C / 77°F

4 hours @ 80°C / 140°F

2 hours @ 120°C / 248°F

DENSITY: Part A 1.0 – 1.2 g/cm3

Part B 1.0 – 1.1 g/cm3

MIXED VISCOSITY: 285 to 295 Pa·s @ 25°C / 77°F

GLASS TRANSITION TEMPERATURE (Tg): 43°C / 109°F

HARDNESS, SHORE: >70 A

VOLUME RESISTIVITY: ~15 Ω·cm

DESCRIPTION:

G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on advanced proprietary technology that requires 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-FXNS™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. A heating oven is required for curing. Uses for G6E-FXNS™ epoxy include flexible circuits, medical sensor assembly and repair, etc.

FEATURES:

· Flexible (after curing)

· Silver-Carbon Filled (Non-Magnetic)

· Very Good Electrical Conductivity

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

TYPICAL APPLICATIONS:

· Wearable Electronics

· Medical Sensors

· Fiber-Optics Packaging

· Flexible Electronics, Wiring & Harnesses

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth dark grey paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 1 hour

CURING SCHEDULE: Best results are obtained when product is cured at 1 hour @ 150°C / 302°F

DENSITY: Part A 2.15-2.30 g/cm3

Part B 2.30-2.40 g/cm3

MIXED VISCOSITY: 210 to 220 Pa·s @ 25°C / 77°F

GLASS TRANSITION TEMPERATURE (Tg): 26°C / 79°F

HARDNESS, SHORE: >75 A

VOLUME RESISTIVITY: 0.003 Ω· cm

DESCRIPTION:

G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar materials that are likely to be subjected to vibrations, temperature variations, shock from impact, bending, and mechanical stress. We use a proprietary mix of silver and graphene materials to formulate an adhesive with an outstanding combination of flexibility and low electrical resistivity. Graphene fillers add superior durability, fatigue and crack resistance along with low electrical resistance. A heating oven is strongly recommended for curing. Uses for G6E-FXSG™ epoxy include flexible circuits, medical sensor assembly and repair, etc.

FEATURES:

· Flexible (after curing)

· Silver-Graphene Filled (Non-Magnetic)

· Excellent Electrical Conductivity

· Resistant to Temperature Variations

· Graphene Loaded (Improves Cracking Resistance)

· Wide Temperature Operation (Cracking Resistant)

· Room Temperature / Oven Curable (depending upon desired cure time)

TYPICAL APPLICATIONS:

· Wearable Electronics

· Medical Sensors

· Fiber-Optics Packaging

· Flexible Electronics, Wiring & Harnesses

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic silver paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 1 hour

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

24 hours @ 25°C / 77°F or

3 hours @ 60°C / 140°F followed by 30 minutes

@ 60°C / 140°F to 160°C / 320°F or

1 to 2 hours @ 60°C / 140°F to 160°C / 320°F

DENSITY: Part A 3.1 – 3.2 g/cm3

Part B 3.0 – 3.2 g/cm3

MIXED VISCOSITY: 110 to 125 Pa·s @ 25°C / 77°F

GLASS TRANSITION

TEMPERATURE (Tg): 39°C / 102°F

HARDNESS, SHORE: >40 D

VOLUME RESISTIVITY: 0.0005 Ω·cm

DESCRIPTION:

G6E-P™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials. G6E-P™ is formulated with proprietary nanomaterials and fillers. G6E-P™ epoxy can be cured at room temperature. A heating oven is suggested for faster curing times. G6E-P™ epoxy is low cost as to compared to the silver epoxy. Uses for G6E-P™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc.

FEATURES:

· Carbon Filled (Non-Metallic & Non-Magnetic)

· Low Cost

· Low Density

· Electrically Conductive

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

· Room Temperature / Oven Curable (depending upon desired cure time)

TYPICAL APPLICATIONS:

· Photovoltaic (Solar) Cells

· Casting, Coating & Encapsulation

· EMI / RFI Shielding

· Display Packaging / Bonding

· Temperature Sensitive Electronics

· Medical Devices / Sensors

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM: Part A – smooth thick black paste

Part B – black liquid

MIX RATIO: 100 (Part A) to 32 (Part B) by weight.

POT LIFE: 2 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

24 hours @ 25°C / 77°F

5 hours @ 80°C / 176°F

2 hours @ 120°C / 248°F

DENSITY: Part A 1.0 – 1.1 g/cm3

Part B 1.0 – 1.1 g/cm3

MIXED VISCOSITY: 145 to 155 Pa·s @ 25°C / 77°F

GLASS TRANSITION TEMPERATURE (Tg): 73°C / 163°F

HARDNESS, SHORE: >80 D

VOLUME RESISTIVITY: ~5 Ω·cm

DESCRIPTION:

G6E-HTC™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. This epoxy is low cost as compared to high temperature silver epoxy. Curing of G6E-HTC™ epoxy requires a heating oven. Uses for G6E-HTC™ epoxy include casting, coating, encapsulation, grounding, medical device manufacture and repair, etc.

FEATURES:

· Higher Glass Transition & Operating Temperature

· Carbon Filled (Non-Metallic & Non-Magnetic)

· Low-Cost (as an alternative to silver-based epoxies)

· Electrically Conductive

· Low Density

· Corrosion Resistant

TYPICAL APPLICATIONS:

· Casting, Coating & Encapsulation

· Grounding such as Electrostatic Discharge (ESD)

· Automotive, Aerospace & Defense Industries

· Soldering Replacement

· EMI / RFI Shielding

· Medical Devices

SPECIFICATIONS:

TWO COMPONENT SYSTEM: Part A – smooth black paste

Part B – smooth black paste

MIX RATIO: 100 (Part A) to 80 (Part B) by weight.

POT LIFE: 4 hours

CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.

DENSITY: Part A 1.0 – 1.1 g/cm3

Part B 1.0 – 1.1 g/cm3

MIXED VISCOSITY: 420 Pa·s @ 25°C / 77°F

18 Pa·s @ 80°C / 176°F

OPERATING TEMPERATURE: up to 315°C / 599°F

GLASS TRANSITION TEMPERATURE (Tg): 142°C / 288°F

HARDNESS, SHORE: >85 D

VOLUME RESISTIVITY: ~15 Ω· cm

DESCRIPTION:

G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed based on advanced proprietary technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A heating oven is required for curing. Uses for G6E-HTNS™ epoxy include printed circuit board, RFID tags, medical device manufacture and repair, etc.

FEATURES:

· Higher Glass Transition & Operating Temperature

· Silver-Carbon Filled (Non-Magnetic)

· Very Good Electrical Conductivity

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

· Moderate Cost (as an alternative to silver only based epoxies)

TYPICAL APPLICATIONS:

· Printed Circuit Board Manufacture / Repair

· Radio Frequency Identification (RFID) tags

· EMI / RFI Shielding

· Electrical Sensors / Transducers

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth dark grey paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 4 hours

CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.

DENSITY: Part A 2.15-2.30 g/cm3

Part B 2.30-2.40 g/cm3

MIXED VISCOSITY: 220 to 230 Pa·s @ 25°C / 77°F

OPERATING TEMPERATURE: up to 315°C / 599°F

GLASS TRANSITION TEMPERATURE (Tg): 140°C / 284°F

HARDNESS, SHORE: >83 D

VOLUME RESISTIVITY: 0.003 Ω·cm

DESCRIPTION:

G6E-HTSG™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG™ epoxy is formulated with proprietary nanomaterials and fillers. G6E-HTSG™ epoxy has good electrical conductivity. G6E-HTSG™ epoxy incorporates a proprietary graphene additive to enhance crack resistance. A heating oven is required for curing. Uses for G6E-HTSG™ epoxy include electronics, embedded electrical heater manufacture and repair, etc.

FEATURES:

· Higher Glass Transition & Operating Temperature

· Silver-Graphene Filled (Non-Magnetic)

· Excellent Electrical Conductivity

· Graphene Loaded (Improves Cracking Resistance)

· Wide Temperature Operation (Cracking Resistant)

TYPICAL APPLICATIONS:

· Electronics operated or exposed to High Temperature

· Embedded Electrical Heaters

· EMI / RFI Shielding

· Electrical Sensors / Transducers

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth dark grey paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 50 (Part B) by weight.

POT LIFE: 4 hours

CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.

DENSITY: Part A 3.1-3.3 g/cm3

Part B 3.0-3.2 g/cm3

MIXED VISCOSITY: 290 to 310 Pa·s @ 25°C / 77°F

OPERATING TEMPERATURE: up to 315°C / 599°F

GLASS TRANSITION TEMPERATURE (Tg): 129°C / 264°F

HARDNESS, SHORE: >80 D

VOLUME RESISTIVITY: 0.0005 Ω·cm

Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSHV™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.

KEY FEATURES:

High Viscosity: Improved gap sealing, gap filling, reduced flow, reduced risk of sagging.
High Thermal Conductivity (2.9 W/m·K): Our adhesive ensures efficient heat transfer from the heat-generating component to the heat sink or other thermal management components. It helps in dissipating heat quickly, preventing thermal issues like overheating and performance degradation.
Great Mechanical Properties: A thermal conductive adhesive with excellent mechanical properties can withstand thermal expansions, mechanical stresses, and environmental conditions without compromising the bond's integrity.
Room Temperature/Oven Curable: Room temperature curing is suitable for applications where heating may not be feasible or where components may be sensitive to high temperatures. Oven curing provides faster and more controlled curing conditions, allowing for efficient production processes.
Strong Electrical Resistance: Strong electrical resistance is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly.
Graphene Loaded: Graphene is a two-dimensional material known for its excellent mechanical and thermal properties.

TYPICAL APPLICATIONS:

Electronic Assembly, Thermal Interface Materials (TIMs), Solar panels, Aerospace and Aviation, Automotive Applications, LED Lighting and Medical Devices

DESCRIPTION:

G6E-RTC™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC™ epoxy is formulated with proprietary nanomaterials and fillers to provide its performance characteristics. Room temperature curing eliminates the use of a heating oven during curing to allow easier and safer connection of conductive components or materials. G6E-RTC™ epoxy is an ideal choice for applications involving heat sensitive substrates.

G6E-RTC™ epoxy is low cost (compared with silver), non-metallic and has good electrical conductivity. G6E-RTC™ epoxy is ideal for applications involving manufacture or repair of conductive and temperature sensitive components. Uses for G6E-RTC™ epoxy include printed circuit board, EMI/ RFI shielding assembly and repair, etc.

FEATURES:

· Room Temperature Curable

· Carbon Filled (Non-Metallic / Non-Magnetic)

· Low-Cost (as an alternative to silver-based epoxies)

· Low Density

· Very Good Electrical Conductivity

· Corrosion Resistant

TYPICAL APPLICATIONS:

· Photovoltaic (Solar) Cells

· Casting, Coating & Encapsulation

· Temperature Sensitive Electronics

· Medical Devices / Sensors

· EMI / RFI Shielding

· Cold Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM: Part A – smooth black paste

Part B – smooth black paste

MIX RATIO: 100 (Part A) to 20 (Part B) by weight.

POT LIFE: 15 min

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

4 hours @ 22°C / 72°F

30 minutes @ 60°C / 140°F

10 minutes @ 150°C / 302°F

DENSITY: Part A 1.0 – 1.1 g/cm3

Part B 1.0 – 1.1 g/cm3

MIXED VISCOSITY: 500 Pa·s @ 25°C / 77°F

320 Pa·s @ 50°C / 122°F

TACK-FREE TIME: 1 hour

GLASS TRANSITION TEMPERATURE (Tg): 74°C / 165°F (when cured at 60°C / 140°F)

HARDNESS, SHORE: > 65 D

VOLUME RESISTIVITY: ~15 Ω·cm

DESCRIPTION:

G6E-RTSG™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. G6E-RTSG™ epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity. G6E-RTSG™ epoxy also incorporates a proprietary graphene additive to enhance the crack resistance of the epoxy adhesive.

G6E-RTSG™ epoxy has outstanding electrical conductivity and is ideal for applications involving manufacture or repair of conductive and temperature sensitive components. Uses for G6E-RTSG™ epoxy include cold solder replacement applications, printed circuit board, EMI / RFI shielding assembly/repair, etc.

FEATURES:

· Room Temperature Curable

· Excellent Electrical Conductivity

· Graphene Loaded (Improves Cracking Resistance)

· Wide Temperature Operation (Cracking Resistant)

TYPICAL APPLICATIONS:

· EMI / RFI Shielding

· PCB Manufacture / Repair

· Photovoltaic Cell Packaging

· Temperature Sensitive Electronics Bonding

· Household Electronics Repair

· Display Packaging / Bonding

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic silver paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 20 (Part B) by weight.

POT LIFE: 15 min

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

4 hours @ 25°C / 77°F

30 minutes @ 60°C / 140°F

10 minutes @ 150°C / 302°F

DENSITY: Part A 3.1 – 3.2 g/cm3

Part B 3.0 – 3.2 g/cm3

MIXED VISCOSITY: 440 Pa·s @ 25°C / 77°F

93 Pa·s @ 50°C / 122°F

TACK-FREE TIME: 1 hour

GLASS TRANSITION TEMPERATURE (Tg): 96°C / 205°F (when cured at 60°C / 140°F)

HARDNESS, SHORE: >85 D

VOLUME RESISTIVITY:

0.003 Ω·cm when cured at Room Temperature

0.0001 Ω·cm when cured at 150°C / 302°F

DESCRIPTION:

G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™ epoxy has good electrical conductivity. A heating oven is recommended for faster curing times. Uses for G6E-SG™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc.

FEATURES:

· Silver-Graphene Filled (Non-Magnetic)

· Excellent Electrical Conductivity

· Resistant to Temperature Variations

· Graphene Loaded (Improves Cracking Resistance)

· Wide Temperature Operation (Cracking Resistant)

· Room Temperature / Oven Curable (depending upon desired cure time)

TYPICAL APPLICATIONS:

· Photovoltaic (Solar) Cells

· Casting, Coating & Encapsulation

· EMI / RFI Shielding

· Display Packaging / Bonding

· Temperature Sensitive Electronics

· Medical Devices / Sensors

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic silver paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 50 (Part B) by weight.

POT LIFE: 3 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F

3 hours @ 80°C / 176°F

1 hour @ 150°C / 302°F

DENSITY: Part A 3.1 – 3.2 g/cm3

Part B 3.0 – 3.2 g/cm3

MIXED VISCOSITY: 110 to 120 Pa·s @ 25°C / 77°F

GLASS TRANSITION TEMPERATURE (Tg): 90°C / 194°F

HARDNESS, SHORE: >70 D

VOLUME RESISTIVITY: ~0.0001 Ω·cm

Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSAL™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSAL™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.

KEY FEATURES:

Low Viscosity: our adhesive has a relatively thin consistency, making it easier to apply and spread evenly over the surfaces to be bonded. This property allows for better coverage and reduces the chances of air entrapment, ensuring improved thermal contact between the bonded components.
Thermal Conductivity (1.8 W/m·K): Our adhesive ensures efficient heat transfer from the heat-generating component to the heat sink or other thermal management components. It helps in dissipating heat quickly, preventing thermal issues like overheating and performance degradation.
Graphene Loaded: Graphene is a two-dimensional material known for its excellent mechanical and thermal properties.
Room Temperature/Oven Curable: Room temperature curing is suitable for applications where heating may not be feasible or where components may be sensitive to high temperatures. Oven curing provides faster and more controlled curing conditions, allowing for efficient production processes.
Strong Electrical Resistance: Strong electrical resistance is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly.
Great Mechanical Properties: A thermal conductive adhesive with excellent mechanical properties can withstand thermal expansions, mechanical stresses, and environmental conditions without compromising the bond's integrity.

TYPICAL APPLICATION:

Electronic Assembly, Thermal Interface Materials (TIMs), Solar panels, Aerospace and Aviation, Automotive Applications, LED Lighting and Medical Devices