LOCTITE ABLESTIK 5020, Epoxy Film, Assembly, Glass Supported Adhesive LOCTITE® ABLESTIK 5020 glass supported adhesive film is a higher purity version of ABLEFILM 550 adhesive film. It is designed for substrate attach and sealing microelectronic packages. This adhesive film meets the requirements of MIL-STD-883, Method 5011.

• High purity
• Excellent adhesion to gold-plated surfaces and high strength ensure the integrity of hermetic packages

LOCTITE ABLESTIK 5074, Epoxy Film, Assembly LOCTITE® ABLESTIK 5074 is designed for bonding materials with mismatched coefficients of thermal expansion.

• Flexible
• Reworkable
• Uniform bondline control
• Custom preforms available
• Bonds to a wide variety of substrates

LOCTITE ABLESTIK 517, Epoxy Film, Assembly LOCTITE® ABLESTIK 517 epoxy film adhesive is developed for microelectronic applications. This adhesive is not recommended for gold plated packages.

• Tack-free
• Non-conductive
• Low temperature cure

LOCTITE ABLESTIK 539IA, Epoxy Film, Assembly, Non-conductive Adhesive LOCTITE® ABLESTIK 539IA non-conductive film adhesive is designed for assembly applications. This adhesive film may be die cut to customer specifications.

• Non-conductive
• Uniform bondline control

LOCTITE ABLESTIK 555, Epoxy Film, Assembly LOCTITE® ABLESTIK 555 adhesive is designed for use in assembly operations

• Long work life
• Moisture resistant
• Custom preforms available

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.

• Flexible
• Reworkable
• Resilient bonds between materials with mismatched CTEs

LOCTITE ABLESTIK 566, Epoxy Film, Assembly LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE ABLESTIK 561 adhesive.

• Electrically Insulating
• Low temperature cure
• Flexible

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.

• Low temperature cure
• Flexible
• Good adhesion

LOCTITE ABLESTIK 570, Epoxy Film, Assembly LOCTITE® ABLESTIK 570 is designed for substrate attach.

• Thermally conductive
• High purity

LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 film adhesive maintains electrical continuity between joints.

• Electrically conductive
• Moisture resistant

LOCTITE ABLESTIK ECF 550X, Epoxy Film, Adhesive Film LOCTITE® ABLESTIK ECF 550X adhesive is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y and z axes. When used for substrate attach, this adhesive film acts as an electrical ground plane.

• Electrically conductive
• Thermally conductive

LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane.

• Electrically conductive in x, y, z axes
• Conductive over a high range of frequencies, up the gigahertz range
• Flexible for Bonding Mismatched Adherents

Body Repair – Direct glazing adhesive, 1-component polyurethane, primerless. 2 hours safe drive-away time according to FMVSS. TEROSON® MS 9000 PL HMLC is a 1-component primerless silane-modified polymer direct glazing adhesive for fast and efficient windshield replacement. It is an isocyanate-free adhesive. As no primer is needed, the application process is both safe and raipd. Achieves good adhesion to commonly used direct glazing materials without primer. The tested safe drive-away time is 2 hours according to the US norm FMVSS. Best results are achieved with the TEROSON® ET GUN POWERLINE II. Recommended bondline preparation with TEROSON® VR 10.

• Fast application
• Primerless system
• HMLC high modulus, low conductivity
• Good sag resistance
• UV resistance
• Isocyanate-free
• TÜV approved product

Body Repair – Direct glazing adhesive, 1-component polyurethane. Safe drive-away time of 1 hour acc. to FMVSS and 4 hours acc. to European crash test standard.

TEROSON® PU 8597 HMLC is a 1-component direct glazing adhesive used for windshield replacement where a solid safety guarantee is required. The tested safe drive-away time is 1 hour according to the US norm FMVSS and 4 hours according to the most stringent European crash test standard. Best application results are achieved with the TEROSON® ET GUN POWERLINE II. Bondline preparation with TEROSON® VR 100 and TEROSON® ET SPONGE prior to primer application recommended.

• High European safety standard
• HMLC high modulus, low conductivity
• Good sag resistance
• No stringing
• TÜV approved product
• OEM specified

Direct glazing, polyurethane adhesive with a 15 min safe drive-away time according to FMVSS. TEROSON® PU 8599 (known as TEROSTAT 8599 HMLC) is a direct glazing, polyurethane adhesive with a 15 min safe drive-away time according to FMVSS. It is the fastest product for windscreen replacement and needs to be warmed up prior to application. Best results are achieved with the TEROSON POWERLINE II COMPRESSED AIR GUN. Bondline preparation with TEROSON® VR 10 prior to primer application recommended.

• Fastest safe drive-away time (15 min)
• HMLC high modulus, low conductivity
• High positioning tack
• Very good sag resistance
• No stringing
• TÜV approved product
• OEM specified

Black, 1-part, polyurethane-based, moisture curing direct glazing sealant with excellent sag resistance which cures to an elastic product. TEROSON® PU 9096 PL is a black, 1-part, polyurethane-based, moisture curing direct glazing sealant with excellent sag resistance which cures by reaction with atmospheric moisture to an elastic product. It is used in the bonding of front, rear and side windows into the body of motor vehicles and bonding of side windows made of single–pane glass or insulating glass in bus and rail coach manufacture.

• Excellent adhesion without primer to glass, ceramic coated glass and on painted surfaces
• Good adhesion to primer
• Good adhesion to material residues and PUR pre-coatings
• High curing rate
• High UV resistance without primer
• High shear strength, retained on ageing