LOCTITE MP 218, Solder paste, High activity, Soft residue, Colorless, Sn/Pb soldering

LOCTITE® MP 218 is a high activity, soft residue, colorless solder paste with pin-testable flux that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including Rheometric Pump, Proflow, large and high-density.

Options and Configurations

• Alloy: 63S4,Sn62, Sn63
• Particle Size: Type 3, 3C, 4
• Metal Content: 89.5, 90

• Outstanding humidity resistance - gives excellent coalescence even after 24 hours exposure to 75% RH, thus reducing process variation due to environmental conditions
• Colorless residues for easy post-reflow inspection
• Soft, non-stick, pin testable residues allow easy in-circuit testing
• Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)
• Extended open time and tack life leading to low wastage

Modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in air. LOCTITE® CR 32 is formulated as a modest residue level, halide-free solder paste recommended for Pb-free soldering and Sn/Pb soldering for printing and reflow in air. It offers excellent open time and soldering activity with pale post-soldering residues.

• Non-corrosive residues – eliminates the need for cleaning
• Enhanced activity to deal with poor component solderability
• Resists solder balling
• Wide reflow process window for Sn/Pb and Pb-free soldering
• Suitable for fine pitch, stencil printing applications
• Excellent slump resistance
• Good tack performance and open time
• Probe testable residues with reduced false failures
• Halide free flux classification: ROL0 to ANSI/J-STD-004

LOCTITE ECCOBOND LUX OGR150THTG, Acrylate, Assembly, Photocurable Adhesive LOCTITE® ECCOBOND LUX OGR150THTG photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed areas where light is unable to penetrate. The secondary thermal cure can be done in conventional box or convection conveyor ovens.

• Non-conductive
• Single component
• Photocurable
• High Tg
• Fast UV cure
• Cures in shadowed areas
• Low temperature cure

LOCTITE GC 10, No-clean and Halogen-free Solder Paste, a RoHS-compliant, Excellent resistance in high humidity, Pb-free soldering

LOCTITE® GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys.

Options and Configurations

• Alloy: 97SC (SAC305)
• Particle Size: Type 3, 4, 4.5 (4A), 5

• Halogen-free flux: passes IC with pretreatment IPC-TM-650 EN14582
• Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev. B
• Printing: down to 0.3 mm pitch, up to 72 hours stencil life, up to 24 hours abandon time, suitable for high-speed printing up to 125 mms-1, improved paste-transfer efficiency
• Reflow: enhanced soak process window 150-200ºC (temperature and time), enhanced process window with superior coalescence and wetting, minimal hot clump at 182ºC, superior coalescence and wetting on small components including 01005, very shiny solder joints, clear, colorless residues for easy post-reflow inspection, residues print testable after 4x reflows

LOCTITE GC 3W, Solder paste, Pb-free soldering, Halogen-free, Water Washable flux

LOCTITE® GC 3W is a RoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable for high-density, small to large boards. Residues can be removed with aqueous cleaner followed by deionized water for 5 minutes at 45°C to 60°C.

Options and Configurations

• Alloy: 97SC (SAC305)
• Particle Size: Type 3, 4

• Water washable, Pb-free solder paste
• Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
• Halogen-free flux classification: ORM0 to ANSI/J-STD-004 Rev
• Formulated so residues can be cleaned with deionized water
• Humidity resistance: excellent coalescence after 24 hours exposure to 27°C/80% RH
• Excellent resistance to solder balling, initially and after exposure to humidity
• Suitable for fine pitch, high speed printing up to 150 mms-1 (6"/s)
• Excellent paste transfer efficiency after extended abandon times and extended printing time
• Humidity Resistance: Enhanced tack time
• Suitable for single and double side reflow

LOCTITE HF 108, Solder paste, Pb-free soldering LOCTITE® HF 108 is a high tack, low voiding, RoHS-compliant solder paste designed for medium to large boards. Excellent fine pitch coalescence. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP Cu.

• Colorless residues for easy post-reflow inspection
• Suitable for fine pitch, high speed printing up to 200mm/s (6"/s)
• Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582.
• Halogen-free flux classification: ANSI/J-STD-004 Rev. B for a type ROL0 classification.

LOCTITE HF 212, No-clean and Halogen-free Solder Paste, High tack, Low voiding, RoHS-compliant Pb-free soldering

LOCTITE® HF 212 is a high tack, low voiding, RoHS-compliant solder paste with excellent fine pitch coalescence and extended stencil life and abandon time. Designed for medium to large boards and compatible with many Pb-free alloys.

Options and Configurations

• Alloy: 90iSC, SAC0307, SAC305, SAC387
• Particle Size: Type 3, 4, 4.5 (4A), 5

• Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
• Halogen-free flux classification: ROL0 to ANSI/J-STD-.004 Rev. B
• Printing: Fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours)
• Printing: suitable for high-speed printing up to 150 mm/s
• Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP)
• Colorless residues for easy post-reflow inspection

LOCTITE HF 250DP, Pb-free soldering, Solder paste LOCTITE® HF 250DP solder paste is a halogen-free, no clean, low voiding Pb-free solder paste. It is a low metal content solder paste formulated for dispense applications.

• Optimized to achieve consistent 250 to 300 µm dot diameter using a 27 gauge needle
• Suitable for reflow in nitrogen

LOCTITE HF 2W, Solder paste, Halogen-free, Water washable flux, Low voiding, REACH-compliant, Pb-based soldering

LOCTITE® HF 2W is a low voiding, REACH-compliant solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water in 5 to 15 minutes at 40°C to 60°C.

Options and Configurations

• Alloy: 63S4, Sn63
• Particle Size: Type 3, 3C, 4

• Water washable, tin-lead solder paste
• Halogen-free flux passes IPC-TM-650 2.3.34/EN14582, flux class '0', J-STD004B ORM0
• Suitable for fine pitch, high speed printing
• Excellent resistance to hot slump @ 150°C
• Good humidity resistance to solder balling
• Excellent solderability in air
• Available with anti-tombstoning alloy technology for improved resistance to tombstone defects
• Residues designed for easy removal when cleaned with deionized water

LOCTITE LF 310, No-clean Solder paste, Excellent open time, Pb-free soldering

LOCTITE® LF 310 medium is formulated for use with Pb-free alloys as a no-clean product for printing and reflow in air where process yield is critical. This material offers excellent open time, and good soldering activity over a wide range of reflow profiles and surface finishes.

Options and Configurations

• Alloy: 97SC (SAC305), 96SC (SAC387)
• Particle Size: Type 3

• Specially formulated for Pb-free alloys
• Effective over a wide range of printer cycle times and print speeds
• Long component tack time
• Resists solder balling
• Excellent slump resistance
• Compatible with a wide range of solderable surfaces
• Effective over a wide range of reflow profiles in air or nitrogen
• Produces safe residue - eliminates the need for cleaning
• Low color post reflow residues for easy visual inspection

LOCTITE LF 318, Solder paste, Pb-free soldering LOCTITE® LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times.

LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.

• Good humidity resistance. Gives excellent coalescence even after 72 hours exposure to 27ºC/80% RH, reducing process variation due to environmental factors
• Colorless residues for easy post-reflow inspection
• Soft, non-stick, pin testable residues allow easy in-circuit testing
• Suitable for fine pitch, high speed printing up to 150mm/s (6""/s)
• Extended open time and tack-life leading to low wastage
• Halide-free flux classification: ROL0 to ANSI/J-STD-004

LOCTITE LF 318M, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE LF 318M is a  halide-free, no clean, low voiding Pb-free solder paste which has excellent humidity resistance and a broad process window both for printing and reflow.  This product has high tack force to resist component movement during high speed placement and long printer abandon times.  It shows excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.  It has Halide free flux classification: ROL0 to ANSI/J-STD-004.  It is available in several alloys such as 96SC, 97SC, and in AGS type 3 and DAP type 4 powder sizes.

• Long print abandon time even on small CSP apertures
• Colorless residues for easy post-reflow inspection
• Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)
• Suitable for enclosed head printing
• Halide-free flux classification: ROL0 to ANSI/J-STD-004

LOCTITE LF 620, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE® LF 620 is a halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow . It shows low hot slump to minimize the possibility of bridging and mid-chip solder balling. This product has high tack force to resist component movement during high speed placement and long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper.

• 4 hours between print abandon time even on small CSP apertures.
• Very low hot slump.
• Colorless residues for easy post-reflow inspection
• Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)
• Halide free flux classification: ANSI/J-STD-004 for a type ROL0 classification.

LOCTITE LM 100, no clean flux, RoHS-compliant, Designed for use with low temperature Pb-free solder alloys LOCTITE® LM 100 is a RoHS-compliant solder paste designed for use with low-temperature, Pb-free alloys. Formulated to provide excellent dispensability, printability and solderability in various reflow profiles.

• Stencil and screen print capability
• Wide reflow process window
• Colorless residues
• Good resistance to humidity
• Good solderability to Copper and Matt nickel

LOCTITE 309, Rosin based Cored Solder Wire Flux

LOCTITE® 309 solid flux is based on a blend of novel activators and resins. It has a mild characteristic odor and leaves a clear pale residue. The alloys used for LOCTITE flux cored solder wires conform to the purity requirements of the common national and international standards. A wide range of wire diameters is available manufactured to close dimensional tolerances. LOCTITE 309 flux passes the J-STD-004 SIR test and other elements of J-STD-004 test protocols associated with the flux classification ROM1. LOCTITE 309 passes the Bellcore GR-78-CORE Electromigration test.

*Flux content is dependent on alloy, diameter and number of cores

• Diameter Range: 0.38mm to 1.63mm
• Number of Cores: Varies from 1 to 5

• Rosin based
• Fast soldering
• Pale residues
• Solders difficult surfaces
• Good spread on nickel, stainless steel, chromel, monel, constantin, etc.
• Heat stable – low fuming
• Mild odor

LOCTITE ECCOBOND UF 3800, Epoxy, Underfill LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.

• High Tg
• Reworkable
• Room temperature flow capability
• Fast cure at moderate temperatures
• Minimal stress on other components
• Compatible with most Pb-free and halogen-free solders
• Stable electrical performance in temperature humidity bias