• Pre-melted evaporation cones and discs
• Standard Temescal/Telemark sizes or custom sized to fit your pocket or crucible.
• Rods for continuous processes

Pre-melted pieces, sized to your specifications

These shapes are derived by consolidating the aluminum-beryllium powder formed during hot isostatic pressing (HIP) and cold isostatic pressing (CIP), followed by extrusion. AM 162 Extrusions nominally contains 62% weight beryllium and 38% aluminum.

Because of its light weight and better than average specific strength, the use of AlBeMet® AM 162 Extrusions is an effective way to reduce the size and weight of many structural aerospace components that currently use aluminum and titanium alloys.

FormaMet by Materion Brush Performance Alloys is an aluminum bronze cold working die alloy used for the drawing or forming of stainless steel, low carbon steel and other materials. This unique aluminum bronze was specifically manufactured for industrial tooling, roll forming and deep drawing.

Materion Brush Beryllium & Composites’ AlBeMet® is an alloy of aluminum and beryllium that provides a set of physical and mechanical properties significantly superior to those of conventional aluminum alloys, specifically in terms of thermal management, dimensional stability and reduced weight.

Zentrix offers flanges plated with Ni:Co + Au for use in RF packages. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC). Like all of Zentrix's Ni: Co + Au electroplated finishes, these flanges are compatible with AuSi eutectic die attach. Plated flanges are used for wide variety of applications, including:

• Substrates for gold-plated BeO pill packages. The BeO can be soldered to the plated flange with AuSn solder (also available from Williams).
• Substrates for discrete ringframes that are epoxied onto the flange. The ringframes can be made of liquid crystal polymer (LCP), alumina, or some other dielectric.
• Substrates for circuit boards with cut-outs. The circuit can be formed on FR-4 , Teflon^TM or some other PC board material. The chip is soldered directly onto the flange and is surrounded by the circuit board.

Zentrix's proprietary plating process produces flange surfaces that are free of pits, scratches or other defects that would prevent a good die attach. Scratch-free surfaces are especially important for flanges with outer surfaces made of copper, which is a soft metal.