The Siemens PLM Software Femap Flow product leverages the power of the TMG-Flow solver and provides state-of-the-art computational fluid dynamics (CFD) analysis solutions to Femap. It delivers fast, efficient and accurate solutions to complex CFD problems directly to the engineer's desktop. Femap Flow models 3D fluid velocity, temperature, pressure and other industry-specific results by solving the Navier-Stokes equations for both steady state and transient applications.

It uses an efficient and robust element-based finite volume multigrid solver, supporting the simulation of:

• Laminar and turbulent fluid flow
• Incompressible and supersonic flow
• Forced, natural and mixed convection fluid flow
• Internal and external fluid flow
• Newtonian and non-Newtonian fluid flow

Femap Flow can be explicitly coupled with Femap Thermal and Femap Advanced Thermal for comprehensive thermo-fluid modeling of a wide range of multi-physics problems, including advanced radiation modeling. In addition, the combined results from Femap Thermal and Femap Flow may be used by the Femap NX Nastran solver or other structural analysis solver of choice.

The Siemens PLM Software NX Advanced Flow product is an add-on module to NX Flow. It leverages the TMG-Flow computational fluid dynamics (CFD) solver to simulate complex fluid flow phenomena both accurately and efficiently.

NX Advanced Flow solves practical engineering challenges such as:

Modeling

• High speed compressible flow to find choking conditions or the location of shock waves
• High speed flow in rotating equipment
• The proper physics within multiple parts rotating with respect to each other
• Aerodynamic heating and ablation (may require coupling with NX Advanced Thermal)
• The impact of large scale environmental contaminant dissemination for a given disaster scenario
• Complex turbulent phenomena
• Multi-species fluid mixing
• Rotation and translation motion influencing the fluid flow

The Siemens PLM Software NX Advanced Flow product is an add-on module to NX Flow. It leverages the TMG-Flow computational fluid dynamics (CFD) solver to simulate complex fluid flow phenomena both accurately and efficiently.

NX Advanced Flow solves practical engineering challenges such as:

Modeling

• High speed compressible flow to find choking conditions or the location of shock waves
• High speed flow in rotating equipment
• The proper physics within multiple parts rotating with respect to each other
• Aerodynamic heating and ablation (may require coupling with NX Advanced Thermal)
• The impact of large scale environmental contaminant dissemination for a given disaster scenario
• Complex turbulent phenomena
• Multi-species fluid mixing
• Rotation and translation motion influencing the fluid flow

Calculating

• Buoyancy line of offshore and marine vehicules
• Size and power requirements in the case of a slurry pump application
• Head losses and volume flow rates within a blood pump system
• Drag and lift forces with out most accuracy
• Humidity effects such as condensation on windshields

Optimizing

• Aerodynamic shape
• Turbomachinery components
• Air intake assembly
• Composite material oven components, including evaporation

The Siemens PLM Software NX Electronic System Cooling product is an industry-specific vertical application that leverages the TMG-Flow and TMG-Thermal solvers as well as the PCB.xchange and other high tech and electronics industry-specific cooling capabilities in a bundle product. It provides a comprehensive set of tools to simulate 3D air flow and thermo-fluid behaviour in high tech and electronic systems. NX Electronic Systems Cooling helps resolve thermal engineering challenges early in the design process and is a valuable aid in understanding the physics of fluid flow and heat transfer for electronic enclosures and cooling applications.

Some practical applications

• Determining electronic systems cooling strategies
• Enclosure, subsystem, and power supply thermal management
• Detailed thermal design of PC boards and multi-chip modules
• Thermally sensitive and critical components placement
• Heat sinks modeling
• Spacing requirements between critical parts
• Predicting fan operating conditions
• Volume and mass flow estimations
• Computing pressure inlet/outlet gradients and head losses
• Identifying recirculation areas and hot spot issues

NX Electronic Systems Cooling has an interface with EDA design systems for direct and bi-directional PCB and FPC data exchanges. All of the leading PCB and FPC layout software packages are supported:

• Zuken
• Mentor Graphics
• Cadence
• VeriBest
• OrCAD
• Incases
• Comtel

The Siemens PLM Software NX I-deas ESC product leverages the TMG-Flow solver to provide a comprehensive set of tools to simulate 3D fluid flow and thermo-fluid behaviour. With its powerful computational fluid dynamics capabilities, it is ideal for many automotive, high speed compressible flows, high tech and electronic system cooling, HVAC, industrial and many other applications. NX I-deas ESC helps resolve CFD engineering challenges early in the design process and is a valuable aid in understanding the physics of fluid flow and heat transfer. Modeling of complex assemblies is made easy with NX I-deas MasterFEM. NX I-deas ESC can be explicitly coupled to NX I-deas TMG Radiation, offering advanced radiation heat transfer coupling capabilities. Flow and thermal results can also be mapped and used as boundary conditions for thermal stress and fluid structure analysis with Model Solution or NX Nastran add-on products.

The complete TMG-Thermal heat transfer solver capabilities can be explicitly coupled to the TMG-Flow CFD solver capabilities for simulation of strong thermo-fluid interactions and conjugate heat transfer. This multi-physics coupling capability is offered at no extra cost. No additional licenses are required, other than for the thermal and CFD product module. The thermo-fluid solver handles disjoint meshes at fluid/solid boundaries allowing great flexibility in assembly context thermo-fluid interactions. The fluid domain and thermal domain do not need to share nodes at the solid/fluid interface since the coupled solver will create the appropriate heat transfer coupling at all the solid/fluid interfaces at runtime.

The thermo-fluid explicit solver coupling models 3D fluid velocity, temperature and pressure by solving the Navier-Stokes equations:

• Laminar and turbulent fluid flow
• Incompressible and compressible fluid flow
• Internal and external fluid flow
• Steady state and transient simulation
• Linear and nonlinear applications
• Coupled conduction, explicit convection and radiation heat transfer

The flow solver uses an efficient and robust element-based finite volume multigrid solver for fast and reliable solutions. Using advanced finite differenc control volume technology, the thermal solver makes it easy to model nonlinear and transient heat transfer processes.

For the most advanced thermo-fluid modeling requirements:

• High-speed rotating systems
• Moving and rotating walls
• Highly turbulent flow
• Particle and scalar data tracking
• Humidity distribution and condensation
• HVAC in cabin with solar flux including proper attenuation effects and shadowing
• Radiative ray tracing in optical systems coupled with surrounding fluid disturbances