MACOM's CMOS switch drivers are used extensively in wireless infrastructure base stations as well as aerospace and defense applications. Drivers are typically used to translate TTL control voltages for RF and microwave attenuators and switches. Typical applications include; Cordless and mobile phones, Cellular base stations/wireless infrastructure, Satellite radio, GPS and DAB, 2.4 GHz and 5.0 GHz WLAN, VSAT, CATV and broadband, Commercial and military radar, and multi-market applications.

MACOM offers a leading-edge portfolio of LED and laser driver solutions for innovative OEM display products. Our programmable, low power, high-performance products are ideally suited for head-up and head mounted displays, multicolor LED/laser displays, backlight illumination applications, high current laser/LED systems and LCD/LCoS/DLP portable and pico projectors.

MACOM has a large portfolio of optical drivers for applications covering distances of hundreds of meters up to thousands of kilometers at data rates from 1 Gbps up to 100 Gbps and beyond. This includes drivers for high performance Mach-Zehnder modulators, externally modulated lasers (EML) and directly modulated lasers (DML). Developed using Gallium Arsenide, Indium Phosphide and Silicon Germanium technologies, these drivers offer solutions for every application from FTTx and short range pluggable transceivers to ultra-long-haul transponders for submarine applications. Drivers for current generation systems typically operate in a limiting mode while next generation high speed systems using higher order modulation schemes use linear drivers. MACOM’s drivers are available in a range of packaging solutions including GPPO modules, surface mount package, and as bare die for integration in a TOSA. Single, dual and quad channel models are also available. All of MACOMs drivers focus on achieving maximum signal integrity with the minimum power dissipation in the smallest form factor.

MACOM has a large portfolio of optical drivers for applications covering distances of hundreds of meters up to thousands of kilometers at data rates from 1 Gbps up to 100 Gbps and beyond. This includes drivers for high performance Mach-Zehnder modulators, externally modulated lasers (EML) and directly modulated lasers (DML). Developed using Gallium Arsenide, Indium Phosphide and Silicon Germanium technologies, these drivers offer solutions for every application from FTTx and short range pluggable transceivers to ultra-long-haul transponders for submarine applications. Drivers for current generation systems typically operate in a limiting mode while next generation high speed systems using higher order modulation schemes use linear drivers. MACOM’s drivers are available in a range of packaging solutions including GPPO modules, surface mount package, and as bare die for integration in a TOSA. Single, dual and quad channel models are also available. All of MACOMs drivers focus on achieving maximum signal integrity with the minimum power dissipation in the smallest form factor.

MACOM has a large portfolio of optical drivers for applications covering distances of hundreds of meters up to thousands of kilometers at data rates from 1 Gbps up to 100 Gbps and beyond. This includes drivers for high performance Mach-Zehnder modulators, externally modulated lasers (EML) and directly modulated lasers (DML). Developed using Gallium Arsenide, Indium Phosphide and Silicon Germanium technologies, these drivers offer solutions for every application from FTTx and short range pluggable transceivers to ultra-long-haul transponders for submarine applications. Drivers for current generation systems typically operate in a limiting mode while next generation high speed systems using higher order modulation schemes use linear drivers. MACOM’s drivers are available in a range of packaging solutions including GPPO modules, surface mount package, and as bare die for integration in a TOSA. Single, dual and quad channel models are also available. All of MACOMs drivers focus on achieving maximum signal integrity with the minimum power dissipation in the smallest form factor.