Integrated Heat Pipe Assemblies solve thermal design issues where space is limited or airflow is not available directly over the heat spot device. Examples of application characteristics include,

-Limited Height/space —Heat pipes can spread the cooling solution volume horizontally
-Sealed Enclosures— Heat pipes could be used to transport the heat from the device to the wall of the enclosure for heat dissipation and allowing the enclosure to remain sealed.
-Obstructed Airflow— Heat pipe allows the condenser to be placed in an area of unobstructed airflow to provide the necessary cooling.

Target Market - Industrial Rugged Computing, Server, Storage, Telecommunication

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