One component epoxy is a premixed adhesive system with base epoxy resin already blended with the appropriate amount of catalyst or hardener that will only react and polymerize when being exposed to the required heating temperature.

One part epoxy systems require no mixing and simplify processing. These products are available in liquid, paste and solid (such as films/performs) forms. Thermal curing, UV light cure and dual UV/heat curing systems are compounded to meet demanding specifications.

One part epoxy compositions are designed to eliminate waste, accelerate productivity while alleviating concerns regarding mix ratios, weighing, working life and shelf life.

Due to its robust characteristics, storage temperature, and worklife, one component epoxy is being applied for surface mount devices, chip on board epoxy (COB epoxy), underfill epoxy, and many sealing and bonding purposes in the electronic field.